Inventor · disambiguated record
Ying-Feng Pang
Also filed as: PANG YING · PANG YING-FENG
13 granted patents·13 pending applications·20 citations·filing 2014–2024
85Inventor score
Top patents by PatentIndex Score
26 records- 0193US9859424B2Techniques for integration of Ge-rich p-MOS source/drain contactsINTEL CORP·Filed 2014·Granted Jan 2, 2018·12 cites·25 claims
- 0286US10147817B2Techniques for integration of Ge-rich p-MOS source/drainINTEL CORP·Filed 2018·Granted Dec 4, 2018·3 cites·20 claims
- 0383US10541334B2Techniques for integration of Ge-rich p-MOS source/drainINTEL CORP·Filed 2018·Granted Jan 21, 2020·2 cites·20 claims
- 0474US10930575B2Reconfigurable cooling assembly for integrated circuitryINTEL CORP·Filed 2016·Granted Feb 23, 2021·3 cites·25 claims
- 0571US12500137B2Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2023·Granted Dec 16, 2025·0 cites·5 claims
- 0659US2025123887A1Systems, apparatus, and methods for energy harvesting in data centersINTEL CORP·Filed 2024·Application pending·0 cites
- 0758US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 0858US11917790B2Thermal control for processor-based devicesINTEL CORP·Filed 2020·Granted Feb 27, 2024·0 cites·22 claims
- 0958US2024365513A1Optimized and automated dynamic thermal regulation method and apparatus with self-tuning two-phase cooling systemINTEL CORP·Filed 2023·Application pending·0 cites
- 1056US12169180B2Optical leak detection of liquid cooling components within an electronic systemINTEL CORP·Filed 2020·Granted Dec 17, 2024·0 cites·20 claims
- 1155US2024276675A1Methods and apparatus to mitigate hotspots in integrated circuit packages using gimbaling nozzles and jet vectoring impingementINTEL CORP·Filed 2024·Application pending·0 cites
- 1254US2021351106A1Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2020·Application pending·0 cites
- 1353US2024240688A1Mitigation of seismic event effects on liquid immersion cooling systemsGENG PHIL·Filed 2024·Application pending·0 cites
- 1450US12424513B2Technologies for isolated heat dissipating devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·19 claims
- 1550US12213288B2Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chipsINTEL CORP·Filed 2020·Granted Jan 28, 2025·0 cites·21 claims
- 1650US2024029539A1Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirsINTEL CORP·Filed 2023·Application pending·0 cites
- 1750US2023422389A1Cold plates for secondary side components of printed circuit boardsINTEL CORP·Filed 2023·Application pending·0 cites
- 1848US2024097579A1Parallel Multi-Converter and Capacity Design Method ThereforUNIV MACAU·Filed 2022·Application pending·0 cites
- 1947US2024244800A1Hybrid cooler to thermally cool semiconductor devices inside and outside a chip packageINTEL CORP·Filed 2021·Application pending·0 cites
- 2043US10755984B2Replacement channel etch for high quality interfaceINTEL CORP·Filed 2015·Granted Aug 25, 2020·0 cites·11 claims
- 2142US2022117112A1Enhanced electronic package thermal dissipation with in-situ transpiration cooling and reduced thermal interstitial resistanceINTEL CORP·Filed 2020·Application pending·0 cites
- 2241US2023016098A1Field replaceable fan assemblies for peripheral processing units and related systems and methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2340US2022225542A1Thin form factor assemblies for cooling dimmsINTEL CORP·Filed 2022·Application pending·0 cites
- 2436US11476164B2Integrated circuit structures having differentiated workfunction layersINTEL CORP·Filed 2017·Granted Oct 18, 2022·0 cites·19 claims
- 2536US10510848B2Sub-fin sidewall passivation in replacement channel FinFETSINTEL CORP·Filed 2015·Granted Dec 17, 2019·0 cites·20 claims
- 2635US2019305102A1Cmos device including pmos metal gate with low threshold voltageINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →