Inventor · disambiguated record
Zhongping Bao
Also filed as: BAO ZHONGPING
8 granted patents·2 pending applications·165 citations·filing 2010–2015
87Inventor score
Top patents by PatentIndex Score
10 records- 0196US9263186B2DC/ AC dual function Power Delivery Network (PDN) decoupling capacitorQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·38 cites·34 claims
- 0296US8963339B2Stacked multi-chip integrated circuit packageQUALCOMM INC·Filed 2012·Granted Feb 24, 2015·59 cites·28 claims
- 0392US8937384B2Thermal management of integrated circuits using phase change material and heat spreadersBAO ZHONGPING·Filed 2012·Granted Jan 20, 2015·48 cites·31 claims
- 0479US9406649B2Stacked multi-chip integrated circuit packageQUALCOMM INC·Filed 2015·Granted Aug 2, 2016·3 cites·30 claims
- 0579US9379065B2Crack stopping structure in wafer level packaging (WLP)QUALCOMM INC·Filed 2013·Granted Jun 28, 2016·5 cites·24 claims
- 0675US8847391B2Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or crackingQUALCOMM INC·Filed 2013·Granted Sep 30, 2014·4 cites·58 claims
- 0771US8601428B2System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing deviceBURRELL JAMES D·Filed 2012·Granted Dec 3, 2013·5 cites·36 claims
- 0868US9184144B2Interconnect pillars with directed compliance geometryBAO ZHONGPING·Filed 2011·Granted Nov 10, 2015·3 cites·19 claims
- 0944US2016013136A1Structure and method for protecting stress-sensitive integrated circuitQUALCOMM INC·Filed 2014·Application pending·0 cites
- 1037US2012025362A1Reinforced Wafer-Level Molding to Reduce WarpageCHANDRASEKARAN ARVIND·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →