Inventor · disambiguated record
Curtis W. Ward
Also filed as: WARD CURTIS · WARD CURTIS W
18 granted patents·7 pending applications·42 citations·filing 2003–2025
93Inventor score
Top patents by PatentIndex Score
25 records- 0196US10892223B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2016·Granted Jan 12, 2021·11 cites·25 claims
- 0295US12218052B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 0395US10460993B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Oct 29, 2019·6 cites·5 claims
- 0494US10777656B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Sep 15, 2020·3 cites·23 claims
- 0591US11854787B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2022·Granted Dec 26, 2023·1 cites·19 claims
- 0688US2025125260A1Advanced lithography and self-assembled devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0787US11881520B2Fin patterning for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Jan 23, 2024·2 cites·10 claims
- 0887US9893167B2Integration methods to fabricate internal spacers for nanowire devicesINTEL CORP·Filed 2014·Granted Feb 13, 2018·9 cites·30 claims
- 0987US2025359007A1Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2025·Application pending·0 cites
- 1086US11145541B2Conductive via and metal line end fabrication and structures resulting therefromINTEL CORP·Filed 2017·Granted Oct 12, 2021·5 cites·18 claims
- 1186US11063133B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Jul 13, 2021·1 cites·24 claims
- 1285US11373950B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2020·Granted Jun 28, 2022·1 cites·19 claims
- 1384US12426230B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1483US10930753B2Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Feb 23, 2021·1 cites·12 claims
- 1580US11646359B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 1677US11640985B2Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 1776US12016170B2Fin cut and fin trim isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Granted Jun 18, 2024·0 cites·17 claims
- 1873US12080639B2Contact over active gate structures with metal oxide layers to inhibit shortingINTEL CORP·Filed 2019·Granted Sep 3, 2024·1 cites·17 claims
- 1972US11972979B21D vertical edge blocking (VEB) via and plugINTEL CORP·Filed 2023·Granted Apr 30, 2024·0 cites·22 claims
- 2055US11721580B21D vertical edge blocking (VEB) via and plugINTEL CORP·Filed 2019·Granted Aug 8, 2023·0 cites·11 claims
- 2155US2023207664A1Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
- 2248US2025386564A1Patterned trenches for nanoribbon-based transistor registration and alignmentINTEL CORP·Filed 2024·Application pending·0 cites
- 2336US2004265748A1Pattern transfer of an extreme ultraviolet imaging layer via flood exposure of contact mask layer (EUV CML)Filed 2003·Application pending·0 cites
- 2434US2005263899A1Photoresist process to enable sloped passivation bondpad openings for ease of metal step coveringsSIVAKUMAR SWAMINATHAN·Filed 2005·Application pending·0 cites
- 2532US2005148180A1Photoresist process to enable sloped passivation bondpad openings for ease of metal step coveringsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →