Inventor · disambiguated record
Darvin R. Edwards
Also filed as: EDWARDS DARVIN · EDWARDS DARVIN R · EDWARDS DARVIN RENNE
27 granted patents·9 pending applications·1,227 citations·filing 1991–2016
97Inventor score
Top patents by PatentIndex Score
36 records- 0199US7892889B2Array-processed stacked semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2009·Granted Feb 22, 2011·136 cites·5 claims
- 0297US5083187AIntegrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 1991·Granted Jan 21, 1992·308 cites·7 claims
- 0394US7174194B2Temperature field controlled scheduling for processing systemsTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 6, 2007·104 cites·15 claims
- 0492US6365958B1Sacrificial structures for arresting insulator cracks in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 2, 2002·180 cites·1 claims
- 0591US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 0691US6080650AMethod and apparatus for attaching particles to a substrateTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 27, 2000·78 cites·8 claims
- 0789US5321277AMulti-chip module testingTEXAS INSTRUMENTS INC·Filed 1993·Granted Jun 14, 1994·84 cites·15 claims
- 0888US9698075B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2016·Granted Jul 4, 2017·5 cites·14 claims
- 0983US6979899B2System and method for high performance heat sink for multiple chip devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 27, 2005·28 cites·8 claims
- 1083US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 1180US6950310B2System and method for self-leveling heat sink for multiple height devicesTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 27, 2005·29 cites·21 claims
- 1278US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 1377US9496198B2Integration of backside heat spreader for thermal managementTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 15, 2016·3 cites·9 claims
- 1477US6064576AInterposer having a cantilevered ball connection and being electrically connected to a printed circuit boardTEXAS INSTRUMENTS INC·Filed 1997·Granted May 16, 2000·51 cites·16 claims
- 1576US7291913B2System and method for high performance heat sink for multiple chip devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 6, 2007·6 cites·10 claims
- 1674US6586839B2Approach to structurally reinforcing the mechanical performance of silicon level interconnect layersTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 1, 2003·23 cites·9 claims
- 1770US8716068B2Method for contacting agglomerate terminals of semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2013·Granted May 6, 2014·2 cites·17 claims
- 1868US7495749B2Rapid method for sub-critical fatigue crack growth evaluationTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 24, 2009·1 cites·20 claims
- 1966US6730541B2Wafer-scale assembly of chip-size packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted May 4, 2004·33 cites·7 claims
- 2065US7267861B2Solder joints for copper metallization having reduced interfacial voidsTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 11, 2007·3 cites·17 claims
- 2162US7296168B2Method and apparatus to minimize power and ground bounce in a logic deviceTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 13, 2007·9 cites·35 claims
- 2258US5406028APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1994·Granted Apr 11, 1995·24 cites·9 claims
- 2356US8643165B2Semiconductor device having agglomerate terminalsEDWARDS DARVIN R·Filed 2012·Granted Feb 4, 2014·1 cites·2 claims
- 2453US2009294937A1Two-way heat extraction from packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 2551US5579249ASystem for modeling an integrated chip package and method of operationTEXAS INSTRUMENTS INC·Filed 1993·Granted Nov 26, 1996·22 cites·16 claims
- 2648US2008023805A1Array-Processed Stacked Semiconductor PackagesTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2748US2008073778A1Two-way heat extraction from packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2847US9142496B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 22, 2015·0 cites·4 claims
- 2947US2010300654A1Modified heat pipe for phase change cooling of electronic devicesEDWARDS DARVIN RENNE·Filed 2009·Application pending·0 cites
- 3046US6450397B1Method of making ball grid array columnsTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 17, 2002·1 cites·16 claims
- 3143US2008122061A1Semiconductor chip embedded in an insulator and having two-way heat extractionTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3241US5604687AThermal analysis system and method of operationTEXAS INSTRUMENTS INC·Filed 1994·Granted Feb 18, 1997·12 cites·14 claims
- 3339US2006038272A1Stacked wafer scale packageTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 3438US2005133901A1System and method for delivering power to a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 3538US2013001746A1Multi-finger capacitor with reduced series resistanceTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 3637US2002114143A1Chip-scale packages stacked on folded interconnector for vertical assembly on substratesFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →