Inventor · disambiguated record
Twila J. Eichman
Also filed as: EICHMAN TWILA J · EICHMAN TWILA JO
2 granted patents·1 citations·filing 2013–2019
29Inventor score
Top patents by PatentIndex Score
2 records- 0165US10537019B1Substrate dielectric crack prevention using interleaved metal planeNXP USA INC·Filed 2019·Granted Jan 14, 2020·1 cites·16 claims
- 0236US9111937B2Semiconductor devices with multilayer flex interconnect structuresFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Aug 18, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →