Inventor · disambiguated record
Shinsuke Onishi
Also filed as: ONISHI SHINSUKE
8 granted patents·3 pending applications·36 citations·filing 1990–2025
80Inventor score
Files withHONDA MOTOR CO LTD3OKI SEMICONDUCTOR CO LTD3KANSAI PAINT CO LTD2OKI ELECTRIC IND CO LTD1OKUBO NARUHIKO1
Top patents by PatentIndex Score
11 records- 0171US5344740APositive-type photosensitive electrodeposition coating composition containing quinonediazide resin having an anion-forming group and a nitrogen-containing compound and process for producing circuit plate using sameKANSAI PAINT CO LTD·Filed 1992·Granted Sep 6, 1994·27 cites·7 claims
- 0258US2025296263A1Cutting apparatusHONDA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0354US9192974B2Work-punching device, work-punching method, and method for producing element for continuously variable transmissionOKUBO NARUHIKO·Filed 2011·Granted Nov 24, 2015·1 cites·2 claims
- 0446US7564265B2Semiconductor device with its test time reduced and a test method thereforOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Jul 21, 2009·1 cites·8 claims
- 0546US7106139B2Amplification circuit and oscillation circuit including inverter circuits having a same threshold voltageOKI ELECTRIC IND CO LTD·Filed 2002·Granted Sep 12, 2006·4 cites·20 claims
- 0641US7724024B2Semiconductor device with its test time reduced and a test method thereforOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted May 25, 2010·0 cites·4 claims
- 0740US11342822B2Apparatus and method for bendingHONDA MOTOR CO LTD·Filed 2019·Granted May 24, 2022·0 cites·7 claims
- 0839US2013186245A1Punching apparatus and methodHONDA MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 0936US7557604B2Input circuit for mode settingOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Jul 7, 2009·0 cites·14 claims
- 1036US2013227999A1Workpiece punch-molding method and workpiece punch-molding deviceONISHI SHINSUKE·Filed 2011·Application pending·0 cites
- 1131US5236810AProcess for preparing printed-circuit boardKANSAI PAINT CO LTD·Filed 1990·Granted Aug 17, 1993·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →