Inventor · disambiguated record
Boon Huat Lim
Also filed as: LIM BOON H · LIM BOON HUAT
6 granted patents·6 citations·filing 2000–2014
72Inventor score
Files withINFINEON TECHNOLOGIES AG2SEMICONDUCTOR COMPONENTS IND2LIM BOON HUAT1PACIFIC MICROCHIP CORP1
Top patents by PatentIndex Score
6 records- 0160US9324642B2Method of electrically isolating shared leads of a lead frame stripINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 26, 2016·2 cites·20 claims
- 0259US8637977B2Semiconductor device and method of packaging a semiconductor device with a clipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 28, 2014·1 cites·18 claims
- 0343US8486757B2Semiconductor device and method of packaging a semiconductor device with a clipLIM BOON HUAT·Filed 2009·Granted Jul 16, 2013·0 cites·22 claims
- 0439US6588098B1Method for manufacturing an electronic device packageSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Jul 8, 2003·2 cites·3 claims
- 0539US6376266B1Semiconductor package and method for forming sameSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Apr 23, 2002·1 cites·16 claims
- 0630US9628263B2Signal digitizer and cross-correlation application specific integrated circuitPACIFIC MICROCHIP CORP·Filed 2014·Granted Apr 18, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →