Inventor · disambiguated record
Yun-Hsiang Tien
Also filed as: TIEN YUN-HSIANG
6 granted patents·2 pending applications·50 citations·filing 2003–2020
78Inventor score
Top patents by PatentIndex Score
8 records- 0178US7125745B2Multi-chip package substrate for flip-chip and wire bondingADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·26 cites·4 claims
- 0262US6921981B2Ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 26, 2005·14 cites·7 claims
- 0357US7091583B2Method and structure for prevention leakage of substrate stripADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 15, 2006·10 cites·26 claims
- 0451US11670836B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 6, 2023·0 cites·15 claims
- 0545US9219048B2Substrate having pillar group and semiconductor package having pillar groupADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Dec 22, 2015·0 cites·19 claims
- 0642US8089164B2Substrate having optional circuits and structure of flip chip bondingLIN KO-WEI·Filed 2009·Granted Jan 3, 2012·0 cites·17 claims
- 0736US2005248037A1Flip-chip package substrate with a high-density layoutADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0835US2007152348A1Array circuit substrate and wire bonding process using the sameCHEN YING-CHIH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →