Inventor · disambiguated record
Meng Tong Ong
Also filed as: ONG MENG TONG
3 granted patents·8 citations·filing 2012–2013
59Inventor score
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0175US9209152B2Molding material and method for packaging semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 8, 2015·5 cites·23 claims
- 0270US9054063B2High power single-die semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 9, 2015·3 cites·13 claims
- 0335US9373609B2Bump package and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 21, 2016·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →