Inventor · disambiguated record
Shigeru Kawamura
Also filed as: KAWAMURA SHIGERU
7 granted patents·7 pending applications·66 citations·filing 1983–2012
83Inventor score
Top patents by PatentIndex Score
14 records- 0185US6528108B1Method and apparatus for observing porous amorphous film, and method and apparatus for forming the sameTOKYO ELECTRON LTD·Filed 2000·Granted Mar 4, 2003·29 cites·11 claims
- 0275US6800546B2Film forming method by radiating a plasma on a surface of a low dielectric constant filmTOKYO ELECTRON LTD·Filed 2002·Granted Oct 5, 2004·20 cites·9 claims
- 0364US8647440B2Substrate processing method and substrate processing apparatusKAWAMURA SHIGERU·Filed 2007·Granted Feb 11, 2014·3 cites·5 claims
- 0463US6407404B1Apparatus for the examining defect of monolithic substrate and method for examining the sameDENSO CORP·Filed 2000·Granted Jun 18, 2002·5 cites·16 claims
- 0555US4481483ALow distortion amplifier circuitCLARION CO LTD·Filed 1983·Granted Nov 6, 1984·9 cites·4 claims
- 0650US2009065027A1Substrate cleaning apparatus, substrate cleaning method, and substrate treatment apparatusTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 0747US7923680B2Analysis method and analysis apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Apr 12, 2011·0 cites·12 claims
- 0845US8945412B2Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatusKAWAMURA SHIGERU·Filed 2012·Granted Feb 3, 2015·0 cites·4 claims
- 0945US2011058157A1Method of helping particle detection, method of particle detection,apparatus for helping particle detection,and system for particle detectionTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 1045US2008230096A1Substrate cleaning device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 1144US2005143950A1Apparatus and method for measuring or applying thermal expansion/shrinkage rateFiled 2004·Application pending·0 cites
- 1243US2002122879A1Method and apparatus for observing porous amorphous film, and method and apparatus for forming the sameTOKYO ELECTRON LTD·Filed 2002·Application pending·0 cites
- 1340US2005026454A1Film forming method and film forming apparatusFiled 2004·Application pending·0 cites
- 1440US2003157559A1Analyzing method for non-uniform-density sample and device and system thereofFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →