Inventor · disambiguated record
Hwan-Sik Lim
Also filed as: LIM HWAN · LIM HWAN-SIK
9 granted patents·5 pending applications·23 citations·filing 2010–2025
82Inventor score
Top patents by PatentIndex Score
14 records- 0182US8680685B2Semiconductor package and method for fabricating the sameLIM HWAN-SIK·Filed 2010·Granted Mar 25, 2014·9 cites·33 claims
- 0279US8823172B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 2, 2014·4 cites·18 claims
- 0379US8519470B2Semiconductor chip, and semiconductor package and system each including the semiconductor chipKANG SUN-WON·Filed 2011·Granted Aug 27, 2013·6 cites·15 claims
- 0470US9013109B2Light-emitting diode lighting device with adjustable current settings and switch voltagesIML INT·Filed 2014·Granted Apr 21, 2015·2 cites·15 claims
- 0565US12237208B2Semiconductor device including device isolation layer with multiple patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 0665US9312213B2Bump structures having an extensionCHO MOON GI·Filed 2013·Granted Apr 12, 2016·2 cites·31 claims
- 0764US2025157852A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0851US8759221B2Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 24, 2014·0 cites·9 claims
- 0947US8497569B2Package substrates and semiconductor packages having the samePARK JIN-WOO·Filed 2011·Granted Jul 30, 2013·0 cites·27 claims
- 1041US8928150B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·5 claims
- 1140US2013256876A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1240US2013009286A1Semiconductor chip and flip-chip package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1337US2013082090A1Methods of forming connection bump of semiconductor deviceCHO MOON-GI·Filed 2012·Application pending·0 cites
- 1435US2012129333A1Method for manufacturing semiconductor package and semiconductor package manufactured using the sameYIM HA-YOUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →