Inventor · disambiguated record
Hou Boon Tan
Also filed as: TAN HOU BOON
2 granted patents·1 pending application·20 citations·filing 1997–2006
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0146US6436736B1Method for manufacturing a semiconductor package on a leadframeSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Aug 20, 2002·5 cites·6 claims
- 0243US5920113ALeadframe structure having moveable sub-frameMOTOROLA INC·Filed 1997·Granted Jul 6, 1999·15 cites·10 claims
- 0333US2008054420A1Semiconductor package structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →