Inventor · disambiguated record
Stephen E. Luce
Also filed as: LUCE STEPHEN E · LUCE STEPHEN ELLINWOOD
67 granted patents·3 pending applications·1,771 citations·filing 1989–2017
99Inventor score
Top patents by PatentIndex Score
70 records- 0199US7193423B1Wafer-to-wafer alignmentsIBM·Filed 2005·Granted Mar 20, 2007·231 cites·4 claims
- 0297US7781781B2CMOS imager array with recessed dielectricIBM·Filed 2006·Granted Aug 24, 2010·65 cites·11 claims
- 0397US5985762AMethod of forming a self-aligned copper diffusion barrier in viasIBM·Filed 1997·Granted Nov 16, 1999·284 cites·12 claims
- 0496US7335577B2Crack stop for low K dielectricsIBM·Filed 2005·Granted Feb 26, 2008·47 cites·9 claims
- 0596US5219788ABilayer metallization cap for photolithographyIBM·Filed 1991·Granted Jun 15, 1993·425 cites·20 claims
- 0694US8546240B2Methods of manufacturing integrated semiconductor devices with single crystalline beamHARAME DAVID L·Filed 2011·Granted Oct 1, 2013·14 cites·17 claims
- 0794US7361989B1Stacked imager packageIBM·Filed 2006·Granted Apr 22, 2008·26 cites·11 claims
- 0893US7884475B2Conductor structure including manganese oxide capping layerIBM·Filed 2007·Granted Feb 8, 2011·24 cites·8 claims
- 0993US7521336B2Crack stop for low K dielectricsIBM·Filed 2007·Granted Apr 21, 2009·22 cites·6 claims
- 1092US8013342B2Double-sided integrated circuit chipsIBM·Filed 2007·Granted Sep 6, 2011·19 cites·16 claims
- 1192US6153043AElimination of photo-induced electrochemical dissolution in chemical mechanical polishingIBM·Filed 1998·Granted Nov 28, 2000·122 cites·20 claims
- 1291US10941036B2Method of manufacturing MEMS switches with reduced switching voltageIBM·Filed 2017·Granted Mar 9, 2021·2 cites·15 claims
- 1391US7015150B2Exposed pore sealing post patterningIBM·Filed 2004·Granted Mar 21, 2006·42 cites·18 claims
- 1489US7670927B2Double-sided integrated circuit chipsIBM·Filed 2006·Granted Mar 2, 2010·15 cites·12 claims
- 1589US7521798B2Stacked imager packageIBM·Filed 2007·Granted Apr 21, 2009·13 cites·10 claims
- 1687US8921201B2Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structureIBM·Filed 2013·Granted Dec 30, 2014·7 cites·15 claims
- 1787US8232190B2Three dimensional vertical E-fuse structures and methods of manufacturing the sameBERNSTEIN KERRY·Filed 2007·Granted Jul 31, 2012·15 cites·11 claims
- 1887US6251787B1Elimination of photo-induced electrochemical dissolution in chemical mechanical polishingIBM·Filed 2000·Granted Jun 26, 2001·38 cites·23 claims
- 1986US8451077B2MEMS switches with reduced switching voltage and methods of manufactureLUCE STEPHEN E·Filed 2008·Granted May 28, 2013·6 cites·12 claims
- 2086US5654221AMethod for forming semiconductor chip and electronic module with integrated surface interconnects/componentsIBM·Filed 1995·Granted Aug 5, 1997·72 cites·21 claims
- 2184US8284017B2Structure having substantially parallel resistor material lengthsHAKEY MARK C·Filed 2011·Granted Oct 9, 2012·7 cites·14 claims
- 2283US8629036B2Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structureLUCE STEPHEN E·Filed 2011·Granted Jan 14, 2014·6 cites·21 claims
- 2380US8421126B2Double-sided integrated circuit chipsBERNSTEIN KERRY·Filed 2011·Granted Apr 16, 2013·4 cites·23 claims
- 2479US7541679B2Exposed pore sealing post patterningIBM·Filed 2005·Granted Jun 2, 2009·5 cites·20 claims
- 2579US5731246AProtection of aluminum metallization against chemical attack during photoresist developmentIBM·Filed 1996·Granted Mar 24, 1998·48 cites·24 claims
- 2678US7989312B2Double-sided integrated circuit chipsIBM·Filed 2009·Granted Aug 2, 2011·6 cites·12 claims
- 2778US6426557B1Self-aligned last-metal C4 interconnection layer for Cu technologiesIBM·Filed 2000·Granted Jul 30, 2002·26 cites·7 claims
- 2874US8004289B2Wafer-to-wafer alignmentsIBM·Filed 2008·Granted Aug 23, 2011·5 cites·13 claims
- 2972US9059396B2Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structureIBM·Filed 2013·Granted Jun 16, 2015·2 cites·10 claims
- 3072US8026606B2Interconnect layers without electromigrationIBM·Filed 2009·Granted Sep 27, 2011·4 cites·11 claims
- 3172US7585758B2Interconnect layers without electromigrationIBM·Filed 2006·Granted Sep 8, 2009·4 cites·8 claims
- 3271US8575668B2Charge breakdown avoidance for MIM elements in SOI base technology and methodCLARK JR WILLIAM F·Filed 2011·Granted Nov 5, 2013·2 cites·18 claims
- 3371US7824961B2Stacked imager packageIBM·Filed 2009·Granted Nov 2, 2010·3 cites·11 claims
- 3470US10640373B2Methods of manufacturing for MEMS switches with reduced switching voltageIBM·Filed 2017·Granted May 5, 2020·0 cites·12 claims
- 3570US8111129B2Resistor and design structure having substantially parallel resistor material lengthsHAKEY MARK C·Filed 2008·Granted Feb 7, 2012·3 cites·8 claims
- 3670US7474104B2Wafer-to-wafer alignmentsIBM·Filed 2006·Granted Jan 6, 2009·5 cites·2 claims
- 3770US7183656B2Bilayer aluminum last metal for interconnects and wirebond padsIBM·Filed 2005·Granted Feb 27, 2007·4 cites·20 claims
- 3870US4944682AMethod of forming borderless contactsIBM·Filed 1989·Granted Jul 31, 1990·36 cites·10 claims
- 3969US10836632B2Method of manufacturing MEMS switches with reduced switching voltageIBM·Filed 2017·Granted Nov 17, 2020·0 cites·18 claims
- 4069US10647569B2Methods of manufacture for MEMS switches with reduced switching voltageIBM·Filed 2017·Granted May 12, 2020·0 cites·11 claims
- 4168US10745273B2Method of manufacturing a switchIBM·Filed 2017·Granted Aug 18, 2020·0 cites·15 claims
- 4268US9944517B2Method of manufacturing MEMS switches with reduced switching volumeIBM·Filed 2015·Granted Apr 17, 2018·0 cites·10 claims
- 4368US9944518B2Method of manufacture MEMS switches with reduced voltageIBM·Filed 2015·Granted Apr 17, 2018·0 cites·11 claims
- 4468US9824834B2Method of manufacturing MEMS switches with reduced voltageIBM·Filed 2015·Granted Nov 21, 2017·0 cites·12 claims
- 4568US6504203B2Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formedIBM·Filed 2001·Granted Jan 7, 2003·12 cites·16 claims
- 4666US9718681B2Method of manufacturing a switchIBM·Filed 2016·Granted Aug 1, 2017·0 cites·14 claims
- 4766US9287075B2MEMS switches with reduced switching voltage and methods of manufactureIBM·Filed 2015·Granted Mar 15, 2016·0 cites·4 claims
- 4865US10017383B2Method of manufacturing MEMS switches with reduced switching voltageIBM·Filed 2015·Granted Jul 10, 2018·0 cites·10 claims
- 4964US9847415B2Field effect transistor and method of manufactureIBM·Filed 2014·Granted Dec 19, 2017·1 cites·20 claims
- 5064US8471306B2Double-sided integrated circuit chipsBERNSTEIN KERRY·Filed 2011·Granted Jun 25, 2013·1 cites·15 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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