Inventor · disambiguated record
Jason P. Ritter
Also filed as: RITTER JASON P
9 granted patents·1 pending application·11 citations·filing 2003–2017
82Inventor score
Top patents by PatentIndex Score
10 records- 0178US9711464B2Semiconductor chip with anti-reverse engineering functionIBM·Filed 2015·Granted Jul 18, 2017·3 cites·13 claims
- 0266US10141274B2Semiconductor chip with anti-reverse engineering functionIBM·Filed 2017·Granted Nov 27, 2018·1 cites·13 claims
- 0361US7572739B2Tape removal in semiconductor structure fabricationIBM·Filed 2005·Granted Aug 11, 2009·2 cites·12 claims
- 0459US8734665B2Slurry for chemical-mechanical polishing of copper and use thereofBATES GRAHAM M·Filed 2011·Granted May 27, 2014·1 cites·19 claims
- 0553US7442552B2Pressurized oxygen for evaluation of molding compound stability in semiconductor packagingIBM·Filed 2007·Granted Oct 28, 2008·1 cites·3 claims
- 0650US9893023B2Semiconductor chip with anti-reverse engineering functionIBM·Filed 2017·Granted Feb 13, 2018·0 cites·5 claims
- 0750US9708508B2Slurry for chemical-mechanical polishing of metals and use thereofGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 18, 2017·0 cites·16 claims
- 0847US9057004B2Slurry for chemical-mechanical polishing of metals and use thereofBATES GRAHAM M·Filed 2011·Granted Jun 16, 2015·0 cites·18 claims
- 0947US7300796B2Pressurized oxygen for evaluation of molding compound stability in semiconductor packagingIBM·Filed 2003·Granted Nov 27, 2007·3 cites·39 claims
- 1041US2009064763A1Pressurized oxygen for evaluation of molding compound stability in semiconductor packagingCOMEAU JOSEPH K V·Filed 2008·Application pending·0 cites
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