Inventor · disambiguated record

Keith Wang

Also filed as: WANG KEITH

2 granted patents·1 citations·filing 2020–2020

30Inventor score

Technology areasG06F H10W

Files withQUALCOMM INC2

Top patents by PatentIndex Score

2 records

0174US11637051B2Integrated device coupled to a step heat sink configured to provide shieldingQUALCOMM INC·Filed 2020·Granted Apr 25, 2023·1 cites·30 claims
0250US11733749B2Electronic device comprising thermally conductive connectorQUALCOMM INC·Filed 2020·Granted Aug 22, 2023·0 cites·14 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →