Inventor · disambiguated record
Kei Murayama
Also filed as: MURAYAMA KEI · MURAYAMA KEI-ICHI
127 granted patents·39 pending applications·1,559 citations·filing 1996–2024
99Inventor score
Files withSHINKO ELECTRIC IND CO123MURAYAMA KEI11PANASONIC CORP6SUNOHARA MASAHIRO4SAKAGUCHI HIDEAKI2
Top patents by PatentIndex Score
166 records- 0197US7279771B2Wiring board mounting a capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 9, 2007·86 cites·5 claims
- 0295US8137497B2Method of manufacturing wiring substrateSUNOHARA MASAHIRO·Filed 2009·Granted Mar 20, 2012·38 cites·14 claims
- 0395US7217888B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted May 15, 2007·79 cites·6 claims
- 0494US7285728B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 23, 2007·35 cites·4 claims
- 0593US7843068B2Semiconductor chip and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 30, 2010·24 cites·5 claims
- 0693US7795140B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·28 cites·12 claims
- 0793US7508057B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·26 cites·10 claims
- 0893US7420128B2Electronic component embedded substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 2, 2008·29 cites·8 claims
- 0992US5736780ASemiconductor device having circuit pattern along outer periphery of sealing resin and related processesSHINKO ELECTRIC IND CO·Filed 1996·Granted Apr 7, 1998·145 cites·20 claims
- 1091US6943442B2Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating filmSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 13, 2005·45 cites·7 claims
- 1190US7884632B2Semiconductor inspecting deviceSHINKO ELECTRIC ELECTRIC IND CO LTD·Filed 2009·Granted Feb 8, 2011·29 cites·5 claims
- 1289US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 1388US11817381B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 14, 2023·2 cites·13 claims
- 1488US8080122B2Method of manufacturing wiring substrate and method of manufacturing semiconductor deviceSUNOHARA MASAHIRO·Filed 2009·Granted Dec 20, 2011·12 cites·9 claims
- 1588US7057290B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jun 6, 2006·30 cites·6 claims
- 1688US5777386ASemiconductor device and mount structure thereofSHINKO ELECTRIC IND CO·Filed 1996·Granted Jul 7, 1998·100 cites·15 claims
- 1787US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 1887US6522022B2Mounting structure for semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2001·Granted Feb 18, 2003·46 cites·7 claims
- 1986US7285862B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 23, 2007·27 cites·4 claims
- 2084US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 2184US6861284B2Semiconductor device and production method thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 1, 2005·25 cites·4 claims
- 2283US7981798B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Jul 19, 2011·12 cites·5 claims
- 2383US7573135B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 11, 2009·6 cites·4 claims
- 2483US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 2582US8111523B2Wiring board with switching function and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Feb 7, 2012·10 cites·6 claims
- 2682US7563987B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Jul 21, 2009·10 cites·3 claims
- 2782US7498200B2Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 3, 2009·7 cites·12 claims
- 2882US6713863B2Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portionSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 30, 2004·29 cites·2 claims
- 2981US7251391B2Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Jul 31, 2007·10 cites·6 claims
- 3080US8368206B2Heat radiation package and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 5, 2013·8 cites·14 claims
- 3180US6538332B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 25, 2003·24 cites·6 claims
- 3280US6404070B1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 11, 2002·31 cites·17 claims
- 3379US8026610B2Silicon interposer and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Sep 27, 2011·8 cites·4 claims
- 3479US8003895B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Aug 23, 2011·8 cites·3 claims
- 3579US7964950B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Jun 21, 2011·5 cites·4 claims
- 3679US7948092B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted May 24, 2011·8 cites·13 claims
- 3779US7882626B2Method of manufacturing wiring board having a semiconductor thereonSHINKO ELECTRIC IND CO·Filed 2009·Granted Feb 8, 2011·8 cites·20 claims
- 3879US6420787B1Semiconductor device and process of producing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 16, 2002·24 cites·11 claims
- 3978US8148738B2Semiconductor device having an element mounted on a substrate and an electrical component connected to the elementMURAYAMA KEI·Filed 2007·Granted Apr 3, 2012·8 cites·12 claims
- 4078US7911048B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Mar 22, 2011·8 cites·9 claims
- 4178US7894201B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 22, 2011·9 cites·3 claims
- 4278US7829993B2Semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 9, 2010·6 cites·5 claims
- 4378US7545049B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 9, 2009·5 cites·6 claims
- 4476US7850344B2Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Dec 14, 2010·7 cites·9 claims
- 4575US9374889B2Interposer and electronic component packageSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 21, 2016·4 cites·6 claims
- 4675US7777349B2Semiconductor apparatus having side surface wiringSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 17, 2010·6 cites·5 claims
- 4775US7691673B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 6, 2010·4 cites·5 claims
- 4874US8183469B2Wiring board and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted May 22, 2012·5 cites·7 claims
- 4974US7794112B2Lighting apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Sep 14, 2010·5 cites·7 claims
- 5073US8338289B2Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through holeMURAYAMA KEI·Filed 2010·Granted Dec 25, 2012·3 cites·17 claims
Showing the top 50 of 166 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →