Assignee
SUNOHARA MASAHIRO
FR·13 granted patents·86 citations·filing 2009–2011
Top patents by PatentIndex Score
13 records- 0195US8137497B2Method of manufacturing wiring substrateSUNOHARA MASAHIRO·Filed 2009·Granted Mar 20, 2012·38 cites·14 claims
- 0288US8080122B2Method of manufacturing wiring substrate and method of manufacturing semiconductor deviceSUNOHARA MASAHIRO·Filed 2009·Granted Dec 20, 2011·12 cites·9 claims
- 0382US8111523B2Wiring board with switching function and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Feb 7, 2012·10 cites·6 claims
- 0476US8212355B2Semiconductor package and manufacturing method of the semiconductor packageSUNOHARA MASAHIRO·Filed 2010·Granted Jul 3, 2012·4 cites·7 claims
- 0575US8446013B2Wiring substrate and method for manufacturing the wiring substrateSUNOHARA MASAHIRO·Filed 2011·Granted May 21, 2013·4 cites·18 claims
- 0675US8309860B2Electronic component built-in substrate and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Nov 13, 2012·6 cites·5 claims
- 0774US8183469B2Wiring board and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted May 22, 2012·5 cites·7 claims
- 0871US8212365B2Printed wiring board and manufacturing method thereofSUNOHARA MASAHIRO·Filed 2010·Granted Jul 3, 2012·3 cites·5 claims
- 0965US8895868B2Wiring substrateSUNOHARA MASAHIRO·Filed 2011·Granted Nov 25, 2014·2 cites·3 claims
- 1065US8119932B2Wiring board and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Feb 21, 2012·2 cites·4 claims
- 1147US8299623B2Semiconductor packageSUNOHARA MASAHIRO·Filed 2010·Granted Oct 30, 2012·0 cites·8 claims
- 1243US8664536B2Wiring substrate and manufacturing method thereofSUNOHARA MASAHIRO·Filed 2011·Granted Mar 4, 2014·0 cites·4 claims
- 1340US8062927B2Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2010·Granted Nov 22, 2011·0 cites·4 claims
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