Inventor · disambiguated record
Hisanori Ota
Also filed as: OTA HISANORI
6 granted patents·7 pending applications·50 citations·filing 2000–2022
80Inventor score
Top patents by PatentIndex Score
13 records- 0178US7662890B2Composition for dip forming and molding obtained by dip formingZEON CORP·Filed 2005·Granted Feb 16, 2010·6 cites·7 claims
- 0278US6844385B1Latex for dip forming and molded object obtained by dip formingZEON CORP·Filed 2000·Granted Jan 18, 2005·27 cites·8 claims
- 0369US7183347B2Dip moldings, composition for dip molding and method for producing dip moldingsZEON CORP·Filed 2001·Granted Feb 27, 2007·10 cites·9 claims
- 0464US2024360296A1Latex Composition for Dip Molding and Method for Producing Dip-Molded ArticleOTA HISANORI·Filed 2022·Application pending·0 cites
- 0561US2023159686A1Composition for dip molding and molded body thereofMIDORI ANZEN CO LTD·Filed 2021·Application pending·0 cites
- 0658US2023357460A1Composition for dip molding and molded body thereofMIDORI ANZEN CO LTD·Filed 2021·Application pending·0 cites
- 0751US7273906B2Dip-forming latex, dip-forming composition and dip-formed articleZEON CORPROATION·Filed 2003·Granted Sep 25, 2007·3 cites·7 claims
- 0851US6878766B2Composition for dip forming, dip-formed object, and process for producing the sameZEON CORP·Filed 2001·Granted Apr 12, 2005·4 cites·19 claims
- 0950US2008255314A1Dip-forming latex, dip-forming composition and dip-formed articleOTA HISANORI·Filed 2007·Application pending·0 cites
- 1049US2007083013A1Dip-forming composition, dip-formed article and process for making sameOTA HISANORI·Filed 2006·Application pending·0 cites
- 1144US7923515B2Dip-forming composition and dip-formed articleZEON CORP·Filed 2004·Granted Apr 12, 2011·0 cites·4 claims
- 1242US2006235158A1Dipping copolymer latexOTA HISANORI·Filed 2004·Application pending·0 cites
- 1341US2005171272A1Dip-forming composition, dip-formed article and process for making sameZEON CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →