Inventor · disambiguated record
Madhava Rao Yalamanchili
Also filed as: YALAMANCHILI MADHAVA RAO
39 granted patents·18 pending applications·277 citations·filing 2007–2024
97Inventor score
Files withAPPLIED MATERIALS INC31LEI WEI-SHENG16CHOWDHURY MOHAMMAD KAMRUZZAMAN2YALAMANCHILI MADHAVA RAO2BLAKELY SOKOLOFF TAYLOR & ZAFM1
Top patents by PatentIndex Score
57 records- 0197US8845854B2Laser, plasma etch, and backside grind process for wafer dicingAPPLIED MATERIALS INC·Filed 2013·Granted Sep 30, 2014·31 cites·9 claims
- 0297US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 0396US9018079B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 28, 2015·26 cites·13 claims
- 0496US8507363B2Laser and plasma etch wafer dicing using water-soluble die attach filmLEI WEI-SHENG·Filed 2011·Granted Aug 13, 2013·24 cites·15 claims
- 0594US8969177B2Laser and plasma etch wafer dicing with a double sided UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·17 cites·22 claims
- 0694US8883614B1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachAPPLIED MATERIALS INC·Filed 2013·Granted Nov 11, 2014·27 cites·18 claims
- 0794US8853056B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Oct 7, 2014·9 cites·10 claims
- 0893US8703581B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Apr 22, 2014·13 cites·14 claims
- 0992US8598016B2In-situ deposited mask layer for device singulation by laser scribing and plasma etchYALAMANCHILI MADHAVA RAO·Filed 2011·Granted Dec 3, 2013·20 cites·29 claims
- 1092US2025022755A1Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1191US8652940B2Wafer dicing used hybrid multi-step laser scribing process with plasma etchAPPLIED MATERIALS INC·Filed 2013·Granted Feb 18, 2014·9 cites·20 claims
- 1289US11621194B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·1 cites·12 claims
- 1389US10566238B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2018·Granted Feb 18, 2020·1 cites·10 claims
- 1487US8993414B2Laser scribing and plasma etch for high die break strength and clean sidewallAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·6 cites·18 claims
- 1586US12131952B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2023·Granted Oct 29, 2024·0 cites·9 claims
- 1686US9252057B2Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer applicationAPPLIED MATERIALS INC·Filed 2013·Granted Feb 2, 2016·7 cites·16 claims
- 1786US9177864B2Method of coating water soluble mask for laser scribing and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Nov 3, 2015·5 cites·10 claims
- 1886US8557683B2Multi-step and asymmetrically shaped laser beam scribingLEI WEI-SHENG·Filed 2011·Granted Oct 15, 2013·6 cites·13 claims
- 1985US8980726B2Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafersAPPLIED MATERIALS INC·Filed 2014·Granted Mar 17, 2015·6 cites·20 claims
- 2085US8946057B2Laser and plasma etch wafer dicing using UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Feb 3, 2015·6 cites·29 claims
- 2184US8951819B2Wafer dicing using hybrid split-beam laser scribing process with plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 10, 2015·6 cites·12 claims
- 2282US9054176B2Multi-step and asymmetrically shaped laser beam scribingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 9, 2015·4 cites·6 claims
- 2382US8859397B2Method of coating water soluble mask for laser scribing and plasma etchLEI WEI-SHENG·Filed 2013·Granted Oct 14, 2014·4 cites·20 claims
- 2479US9263308B2Water soluble mask for substrate dicing by laser and plasma etchLEI WEI-SHENG·Filed 2014·Granted Feb 16, 2016·3 cites·14 claims
- 2577US10163713B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2016·Granted Dec 25, 2018·1 cites·13 claims
- 2677US9245802B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·1 cites·15 claims
- 2776US10910271B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Feb 2, 2021·0 cites·20 claims
- 2876US9620379B2Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Apr 11, 2017·3 cites·10 claims
- 2976US9048309B2Uniform masking for wafer dicing using laser and plasma etchCHOWDHURY MOHAMMAD KAMRUZZAMAN·Filed 2013·Granted Jun 2, 2015·5 cites·22 claims
- 3075US9129904B2Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etchLEI WEI-SHENG·Filed 2011·Granted Sep 8, 2015·3 cites·11 claims
- 3174US8846498B2Wafer dicing using hybrid multi-step laser scribing process with plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Sep 30, 2014·2 cites·23 claims
- 3273US10714390B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2019·Granted Jul 14, 2020·0 cites·10 claims
- 3371US9105710B2Wafer dicing method for improving die packaging qualityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 11, 2015·2 cites·20 claims
- 3471US8975162B2Wafer dicing from wafer backsideAPPLIED MATERIALS INC·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
- 3571US8912077B2Hybrid laser and plasma etch wafer dicing using substrate carrierSINGH SARAVJEET·Filed 2011·Granted Dec 16, 2014·2 cites·19 claims
- 3667US9224625B2Laser and plasma etch wafer dicing using water-soluble die attach filmAPPLIED MATERIALS INC·Filed 2013·Granted Dec 29, 2015·1 cites·15 claims
- 3767US9218992B2Hybrid laser and plasma etch wafer dicing using substrate carrierAPPLIED MATERIALS INC·Filed 2014·Granted Dec 22, 2015·1 cites·16 claims
- 3858US11915932B2Plasma etching of mask materialsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 3954US2014363952A1Laser, plasma etch, and backside grind process for wafer dicingLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 4054US2015028446A1Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approachLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 4149US2014065797A1In-situ deposited mask layer for device singulation by laser scribing and plasma etchYALAMANCHILI MADHAVA RAO·Filed 2013·Application pending·0 cites
- 4246US2015200119A1Laser scribing and plasma etch for high die break strength and clean sidewallEATON BRAD·Filed 2015·Application pending·0 cites
- 4346US2009255555A1Advanced cleaning process using integrated momentum transfer and controlled cavitationBLAKELY SOKOLOFF TAYLOR & ZAFM·Filed 2008·Application pending·0 cites
- 4445US2008163890A1Tunable megasonics cavitation process using multiple transducers for cleaning nanometer particles without structure damageAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4544US2015011073A1Laser scribing and plasma etch for high die break strength and smooth sidewallLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 4644US2014273401A1Substrate laser dicing mask including laser energy absorbing water-soluble filmLEI WEI-SHENG·Filed 2014·Application pending·0 cites
- 4742US9126285B2Laser and plasma etch wafer dicing using physically-removable maskLEI WEI-SHENG·Filed 2011·Granted Sep 8, 2015·0 cites·15 claims
- 4841US2015037915A1Method and system for laser focus plane determination in a laser scribing processLEI WEI-SHENG·Filed 2013·Application pending·0 cites
- 4941US2014335679A1Methods for etching a substrateAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 5040US2008163900A1Ipa delivery system for dryingRICHARDS DOUGLAS·Filed 2007·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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