Inventor · disambiguated record
Jo-Mei Wang
Also filed as: WANG JO-MEI
5 granted patents·26 citations·filing 2015–2017
77Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0192US9922939B2Wafer level shielding in multi-stacked fan out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 20, 2018·8 cites·20 claims
- 0290US9659878B2Wafer level shielding in multi-stacked fan out packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 0386US10177032B2Devices, packaging devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 8, 2019·6 cites·21 claims
- 0477US10276542B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·3 cites·20 claims
- 0574US9941248B2Package structures, pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →