Inventor · disambiguated record
James Mellody
Also filed as: MELLODY JAMES · MELLODY JAMES P
9 granted patents·8 pending applications·21 citations·filing 2003–2024
83Inventor score
Top patents by PatentIndex Score
17 records- 0180US7892883B2Clipless integrated heat spreader process and materialsINTEL CORP·Filed 2008·Granted Feb 22, 2011·9 cites·15 claims
- 0278US8987894B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingINTEL CORP·Filed 2014·Granted Mar 24, 2015·3 cites·17 claims
- 0373US12176318B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0470US8765528B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingHOULE SABINA J·Filed 2013·Granted Jul 1, 2014·2 cites·7 claims
- 0569US8390112B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingHOULE SABINA J·Filed 2008·Granted Mar 5, 2013·3 cites·12 claims
- 0669US8067256B2Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the methodHOULE SABINA J·Filed 2007·Granted Nov 29, 2011·4 cites·10 claims
- 0766US11652080B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 0859US2025391807A1Dynamic substrate thermal displacement compensationINTEL CORP·Filed 2024·Application pending·0 cites
- 0951US2024213074A1Enhanced nozzle for disaggregated die handling during thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 1050US2016043014A1Underfill process and materials for singulated heat spreader stiffener for thin core panel processingINTEL CORP·Filed 2015·Application pending·0 cites
- 1145US2008156895A1Flux overspray reduction apparatus, systems, and methodsMELLODY JAMES P·Filed 2006·Application pending·0 cites
- 1244US2011291304A1Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the methodHOULE SABINA J·Filed 2011·Application pending·0 cites
- 1341US7364943B2Method of bonding a microelectronic die to a substrate and arrangement to carry out methodINTEL CORP·Filed 2005·Granted Apr 29, 2008·0 cites·30 claims
- 1439US2007035012A1Integrated solder and heat spreader fabricationDEPPISCH CARL L·Filed 2006·Application pending·0 cites
- 1538US8163598B2Clipless integrated heat spreader process and materialsKOSTIEW GEORGE·Filed 2011·Granted Apr 24, 2012·0 cites·6 claims
- 1635US2005121776A1Integrated solder and heat spreader fabricationFiled 2003·Application pending·0 cites
- 1733US2005133934A1Thermal interface material bondingFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →