Inventor · disambiguated record
Lynne M. Gignac
Also filed as: GIGNAC LYNNE · GIGNAC LYNNE M · GIGNAC LYNNE MARIE
29 granted patents·4 pending applications·248 citations·filing 1998–2022
96Inventor score
Top patents by PatentIndex Score
33 records- 0194US7247946B2On-chip Cu interconnection using 1 to 5 nm thick metal capIBM·Filed 2005·Granted Jul 24, 2007·35 cites·14 claims
- 0289US8133767B2Efficient interconnect structure for electrical fuse applicationsYANG CHIH-CHAO·Filed 2010·Granted Mar 13, 2012·9 cites·8 claims
- 0388US6344129B1Method for plating copper conductors and devices formedIBM·Filed 1999·Granted Feb 5, 2002·46 cites·17 claims
- 0484US6429523B1Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2001·Granted Aug 6, 2002·32 cites·35 claims
- 0583US7893520B2Efficient interconnect structure for electrical fuse applicationsIBM·Filed 2008·Granted Feb 22, 2011·9 cites·17 claims
- 0680US11820663B2Crystalline film of carbon nanotubesIBM·Filed 2018·Granted Nov 21, 2023·1 cites·15 claims
- 0780US6784485B1Diffusion barrier layer and semiconductor device containing sameIBM·Filed 2000·Granted Aug 31, 2004·25 cites·15 claims
- 0874US8679970B2Structure and process for conductive contact integrationYANG CHIH-CHAO·Filed 2008·Granted Mar 25, 2014·6 cites·11 claims
- 0973US6448173B1Aluminum-based metallization exhibiting reduced electromigration and method thereforIBM·Filed 2000·Granted Sep 10, 2002·21 cites·12 claims
- 1067US7767962B2Method for SEM measurement of features using magnetically filtered low loss electron microscopyIBM·Filed 2006·Granted Aug 3, 2010·1 cites·17 claims
- 1167US6417567B1Flat interface for a metal-silicon contract barrier filmIBM·Filed 2000·Granted Jul 9, 2002·8 cites·20 claims
- 1266US8823176B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2008·Granted Sep 2, 2014·2 cites·19 claims
- 1365US7105817B2Method of forming images in a scanning electron microscopeIBM·Filed 2005·Granted Sep 12, 2006·1 cites·16 claims
- 1465US6022801AMethod for forming an atomically flat interface for a highly disordered metal-silicon barrier filmIBM·Filed 1998·Granted Feb 8, 2000·23 cites·18 claims
- 1559US6570255B2Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2002·Granted May 27, 2003·7 cites·17 claims
- 1657US6768111B1Method for SEM measurement of topological featuresIBM·Filed 2003·Granted Jul 27, 2004·2 cites·15 claims
- 1756US8716071B2Methods and systems involving electrically reprogrammable fusesIBM·Filed 2013·Granted May 6, 2014·0 cites·4 claims
- 1856US6436823B1Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formedIBM·Filed 2000·Granted Aug 20, 2002·7 cites·17 claims
- 1953US2009045484A1Methods and systems involving electrically reprogrammable fusesIBM·Filed 2007·Application pending·0 cites
- 2052US12329044B2Applying inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devicesIBM·Filed 2021·Granted Jun 10, 2025·0 cites·18 claims
- 2152US6509265B1Process for manufacturing a contact barrierIBM·Filed 2000·Granted Jan 21, 2003·4 cites·9 claims
- 2251US2024099163A1Hydrogen and Hydrocarbon Plasma Treatment of Phase Change Memory MaterialIBM·Filed 2022·Application pending·0 cites
- 2350US10386409B2Non-destructive determination of components of integrated circuitsIBM·Filed 2015·Granted Aug 20, 2019·0 cites·20 claims
- 2450US8889546B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2012·Granted Nov 18, 2014·0 cites·15 claims
- 2550US8535991B2Methods and systems involving electrically reprogrammable fusesCHANDA KAUSHIK·Filed 2010·Granted Sep 17, 2013·0 cites·8 claims
- 2650US6979393B2Method for plating copper conductors and devices formedIBM·Filed 2002·Granted Dec 27, 2005·0 cites·3 claims
- 2748US8866257B2System involving electrically reprogrammable fusesIBM·Filed 2014·Granted Oct 21, 2014·0 cites·5 claims
- 2846US6989282B2Control of liner thickness for improving thermal cycle reliabilityIBM·Filed 2004·Granted Jan 24, 2006·2 cites·13 claims
- 2944US7345305B2Control of liner thickness for improving thermal cycle reliabilityIBM·Filed 2005·Granted Mar 18, 2008·0 cites·15 claims
- 3044US6124639AFlat interface for a metal-silicon contact barrier filmIBM·Filed 1999·Granted Sep 26, 2000·7 cites·20 claims
- 3137US2004077140A1Apparatus and method for forming uniformly thick anodized films on large substratesFiled 2002·Application pending·0 cites
- 3235US2002180046A1Method for producing a flat interface for a metal-silicon contact barrier filmIBM·Filed 2001·Application pending·0 cites
- 3330US6180521B1Process for manufacturing a contact barrierIBM·Filed 1999·Granted Jan 30, 2001·0 cites·11 claims
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