Inventor · disambiguated record
Yi-Shih Hsieh
Also filed as: HSIEH YI-SHIH
5 granted patents·8 pending applications·30 citations·filing 2007–2016
73Inventor score
Files withFURUI PRECISE COMPONENT KUNSHA4FURUI PRECISE COMPONENT KUNSHAN CO LTD3FU ZHUN PRECISION IND SHENZHEN2HSIEH YI-SHIH2FOXCONN TECH CO LTD1
Top patents by PatentIndex Score
13 records- 0186US7606031B2Heat dissipating deviceFU ZHUN PRECISION IND SHENZHEN·Filed 2007·Granted Oct 20, 2009·23 cites·12 claims
- 0277US8453716B2Heat dissipation deviceHSIEH YI-SHIH·Filed 2010·Granted Jun 4, 2013·6 cites·10 claims
- 0358US2010181048A1Heat pipeFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Application pending·0 cites
- 0453US2010236760A1Heat pipeFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Application pending·0 cites
- 0553US2009133855A1Heat dissipation device and assembly method thereofFURUI PRECISE COMPONENT KUNSHA·Filed 2008·Application pending·0 cites
- 0651US9062920B2Heat pipe with sealed vesicleHSIEH YI-SHIH·Filed 2012·Granted Jun 23, 2015·0 cites·10 claims
- 0749US7696769B2Method of obtaining accurately a heat-dissipating requirement for electronic systemsFU ZHUN PRECISION IND SHENZHEN·Filed 2007·Granted Apr 13, 2010·1 cites·5 claims
- 0847US9279622B2Heat dissipation deviceFURUI PRECISE COMPONENT KUNSHAN CO LTD·Filed 2013·Granted Mar 8, 2016·0 cites·5 claims
- 0942US2011048679A1Heat dissipation deviceFURUI PRECISE COMPONENT KUNSHAN CO LTD·Filed 2009·Application pending·0 cites
- 1040US2010212871A1Heat pipe and manufacturing method thereofFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Application pending·0 cites
- 1132US2017269647A1Heat dissipation device and electronic device using the sameHONG FU JIN PREC IND (WUHAN) CO LTD·Filed 2016·Application pending·0 cites
- 1232US2011235280A1Heat dissipation apparatus and electronic assembly with sameFOXCONN TECH CO LTD·Filed 2010·Application pending·0 cites
- 1331US2011235301A1Heat dissipation apparatus and electronic assembly with sameFURUI PRECISE COMPONENT KUNSHAN CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →