Inventor · disambiguated record
Songlin Wang
Also filed as: WANG SONGLIN
5 granted patents·6 pending applications·0 citations·filing 2007–2024
58Inventor score
Files withHUAWEI TECH CO LTD3ZHEJIANG HENGYI PETROCHEMICAL RES INSTITUTE CO LTD2BEIJING RES CT INFORMATION TECH AGRICULTURE1LUO TAO1MAO JEREMY J1
Top patents by PatentIndex Score
11 records- 0156US2025097145A1Link fault handling method, related apparatus, storage medium, and program productHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0252US2019167846A1Mesenchymal stem cell-mediated functional tooth regenerationUNIV SOUTHERN CALIFORNIA·Filed 2019·Application pending·0 cites
- 0352US2024275716A1Fault Handling Method, Related Device, and SystemHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0449US11884632B2Preparation method of caprolactamZHEJIANG HENGYI PETROCHEMICAL RES INSTITUTE CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·21 claims
- 0548US12289855B2Chassis and storage deviceHUAWEI TECH CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 0648US10232080B2Mesenchymal stem cell-mediated function tooth regenerationSHI SONGTAO·Filed 2007·Granted Mar 19, 2019·0 cites·8 claims
- 0744US2014302111A1Compositions and methods for dental tissue regenerationMAO JEREMY J·Filed 2014·Application pending·0 cites
- 0843US11459302B2Refining process and refining system of caprolactamZHEJIANG HENGYI PETROCHEMICAL RES INSTITUTE CO LTD·Filed 2021·Granted Oct 4, 2022·0 cites·20 claims
- 0943US2022001364A1Mfi topological structure silicon molecular sieve, preparation method thereof and catalyst containing the sameZHEJIANG HENGLAN SCIENCE & TECH CO LTD·Filed 2021·Application pending·0 cites
- 1041US9907301B2Device and method for producing quantitative-diameter spray droplets of pesticideBEIJING RES CT INFORMATION TECH AGRICULTURE·Filed 2013·Granted Mar 6, 2018·0 cites·6 claims
- 1138US2013112725A1Vehicle-mounted library workstationLUO TAO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →