Inventor · disambiguated record
Do Woong Hong
Also filed as: HONG DO WOONG
3 granted patents·2 citations·filing 2014–2019
54Inventor score
Files withDOOSAN CORP3
Top patents by PatentIndex Score
3 records- 0181US10584239B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2019·Granted Mar 10, 2020·1 cites·26 claims
- 0271US10590272B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2015·Granted Mar 17, 2020·1 cites·19 claims
- 0350US9957389B2Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminateDOOSAN CORP·Filed 2014·Granted May 1, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →