Inventor · disambiguated record
Jeong Don Kwon
Also filed as: KWON JEONG DON
4 granted patents·1 pending application·2 citations·filing 2008–2019
60Inventor score
Top patents by PatentIndex Score
5 records- 0181US10584239B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2019·Granted Mar 10, 2020·1 cites·26 claims
- 0271US10590272B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2015·Granted Mar 17, 2020·1 cites·19 claims
- 0350US9957389B2Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminateDOOSAN CORP·Filed 2014·Granted May 1, 2018·0 cites·16 claims
- 0441US8802997B2Multi layer circuit board and manufacturing method of the sameKWON JEONG DON·Filed 2008·Granted Aug 12, 2014·0 cites·5 claims
- 0536US2019292364A1Thermosetting resin composition, prepreg using same, laminated sheet, and printed circuit boardDOOSAN CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jeong Don Kwon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →