Inventor · disambiguated record
Dong Hee Jung
Also filed as: JUNG DONG HEE
3 granted patents·1 pending application·2 citations·filing 2014–2019
54Inventor score
Files withDOOSAN CORP4
Top patents by PatentIndex Score
4 records- 0181US10584239B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2019·Granted Mar 10, 2020·1 cites·26 claims
- 0271US10590272B2Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using sameDOOSAN CORP·Filed 2015·Granted Mar 17, 2020·1 cites·19 claims
- 0350US9957389B2Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminateDOOSAN CORP·Filed 2014·Granted May 1, 2018·0 cites·16 claims
- 0436US2019292364A1Thermosetting resin composition, prepreg using same, laminated sheet, and printed circuit boardDOOSAN CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →