Inventor · disambiguated record
Dae-Woo Son
Also filed as: SON DAE-WOO
12 granted patents·3 pending applications·138 citations·filing 1998–2022
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9AMOGREENTECH CO LTD2CHO YOUNG-SANG2CHOI KYOUNG-SEI1HAN SANG-UK1
Top patents by PatentIndex Score
15 records- 0189US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0282US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0382US6103554AMethod for packaging integrated circuits with elastomer chip carriersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Aug 15, 2000·74 cites·16 claims
- 0480US8575735B2Semiconductor chip and film and TAB package comprising the chip and filmCHO YOUNG-SANG·Filed 2011·Granted Nov 5, 2013·6 cites·12 claims
- 0573US8952510B2Semiconductor chip and film and tab package comprising the chip and filmSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·3 cites·21 claims
- 0660US7339262B2Tape circuit substrate and semiconductor apparatus employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 4, 2008·8 cites·39 claims
- 0757US9129972B2Semiconductor packageCHO YOUNG-SANG·Filed 2009·Granted Sep 8, 2015·1 cites·20 claims
- 0851US7247936B2Tape circuit substrate having wavy beam leads and semiconductor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 24, 2007·4 cites·39 claims
- 0950US6902261B2Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assemblySAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 7, 2005·4 cites·30 claims
- 1050US2025079252A1Insulation sheet for chip on film, insulation chip on film package comprising same, and display deviceAMOGREENTECH CO LTD·Filed 2021·Application pending·0 cites
- 1150US2024154081A1Insulation sheet for display light source, and insulation light source module, insulation backlight unit, and display device comprising sameAMOGREENTECH CO LTD·Filed 2022·Application pending·0 cites
- 1248US6421456B1Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marksSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 16, 2002·15 cites·11 claims
- 1344US6818542B2Tape circuit board and semiconductor chip package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 16, 2004·3 cites·5 claims
- 1441US6737590B2Tape circuit board and semiconductor chip package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted May 18, 2004·2 cites·4 claims
- 1537US2012021600A1Method of fabricating film circuit substrate and method of fabricating chip package including the sameHAN SANG-UK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →