Inventor · disambiguated record
Shigeyoshi Ishii
Also filed as: ISHII SHIGEYOSHI
6 granted patents·6 pending applications·99 citations·filing 1996–2012
83Inventor score
Top patents by PatentIndex Score
12 records- 0180US6590070B1Thermosetting adhesive composition and adhered structure3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Jul 8, 2003·20 cites·6 claims
- 0274US7646088B2Adhesive sheet for light-emitting diode device and light-emitting diode device3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted Jan 12, 2010·6 cites·9 claims
- 0374US6265460B1Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition3M INNOVATIVE PROPERTIES CO·Filed 1999·Granted Jul 24, 2001·45 cites·9 claims
- 0466US6051652AReactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive3M INNOVATIVE PROPERTIES CO·Filed 1996·Granted Apr 18, 2000·23 cites·5 claims
- 0559US7973403B2Adhesive sheet for light-emitting diode device and light-emitting diode device3M INNOVATIVE PROPERTIES CO·Filed 2009·Granted Jul 5, 2011·1 cites·3 claims
- 0659US7358289B2Heat-curable adhesive composition3M INNOVATIVE PROPERTIES CO·Filed 2003·Granted Apr 15, 2008·4 cites·8 claims
- 0749US2014370308A1Laminate film for attaching to a window, and a manufacturing method thereof and an applying method thereof3M INNOVATIVE PROPERTIES CO·Filed 2012·Application pending·0 cites
- 0848US2004213973A1Film adhesive for sealing, film laminate for sealing and sealing methodFiled 2004·Application pending·0 cites
- 0943US2004063804A1Thermosetting adhesiveFiled 2002·Application pending·0 cites
- 1040US2014120309A1Laminate window film having micro through holesISHII SHIGEYOSHI·Filed 2012·Application pending·0 cites
- 1137US2004068061A1Thermosetting adhesive film, and an adhesive structure based on the use thereofFiled 2002·Application pending·0 cites
- 1235US2005233161A1Thermosetting adhesive sheet with electroconductive and thermoconductive propertiesTAKEDA MASAAKI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →