Inventor · disambiguated record
Yukio Kenbo
Also filed as: KENBO YUKIO
14 granted patents·247 citations·filing 1982–2005
94Inventor score
Top patents by PatentIndex Score
14 records- 0192US6753972B1Thin film thickness measuring method and apparatus, and method and apparatus for manufacturing a thin film device using the sameHITACHI LTD·Filed 1999·Granted Jun 22, 2004·87 cites·22 claims
- 0292US5329333AExposure apparatus and methodHITACHI LTD·Filed 1992·Granted Jul 12, 1994·45 cites·48 claims
- 0389US6485891B1Exposure apparatus and methodHITACHI LTD·Filed 2000·Granted Nov 26, 2002·21 cites·23 claims
- 0485US7277155B2Exposure apparatus and methodRENESAS TECH CORP·Filed 2005·Granted Oct 2, 2007·4 cites·11 claims
- 0576US6016187AExposure apparatus and methodHITACHI LTD·Filed 1998·Granted Jan 18, 2000·20 cites·17 claims
- 0676US5767949AExposure apparatus and methodHITACHI LTD·Filed 1996·Granted Jun 16, 1998·20 cites·12 claims
- 0770US6335146B1Exposure apparatus and methodHITACHI LTD·Filed 2000·Granted Jan 1, 2002·5 cites·16 claims
- 0869US5526094AExposure apparatus and methodHITACHI LTD·Filed 1994·Granted Jun 11, 1996·11 cites·31 claims
- 0968US6806970B2Thin film thickness measuring method and apparatus, and method and apparatus for manufacturing a thin film device using the sameHITACHI LTD·Filed 2003·Granted Oct 19, 2004·12 cites·10 claims
- 1058US7012671B2Exposure apparatus and methodRENESAS TECH CORP·Filed 2002·Granted Mar 14, 2006·2 cites·18 claims
- 1155US7604925B2Exposure apparatus and methodRENESAS TECH CORP·Filed 2005·Granted Oct 20, 2009·0 cites·10 claims
- 1254US7598020B2Exposure apparatus and methodRENESAS TECH CORP·Filed 2005·Granted Oct 6, 2009·0 cites·10 claims
- 1352US4504045AWafer transforming deviceHITACHI LTD·Filed 1982·Granted Mar 12, 1985·16 cites·9 claims
- 1451US6468817B2Semiconductor integrated circuit device manufacturing method including chemical mechanical polishing, and detection and evaluation of microscratches caused therebyHITACHI LTD·Filed 2001·Granted Oct 22, 2002·4 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →