Inventor · disambiguated record
Vemal Raja Manikam
Also filed as: MANIKAM VEMAL RAJA
5 granted patents·2 pending applications·12 citations·filing 2009–2021
73Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC3BOSCH AUSTRALIA1FREESCALE SEMICONDUCTOR INC1LOW BOON YEW1WONG TZU LING1
Top patents by PatentIndex Score
7 records- 0186US9659837B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted May 23, 2017·5 cites·9 claims
- 0273US9991185B2Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 5, 2018·2 cites·19 claims
- 0369US8237293B2Semiconductor package with protective tapeWONG TZU LING·Filed 2010·Granted Aug 7, 2012·4 cites·20 claims
- 0462US2020161209A1Direct bonded copper semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 0551US7989965B2Underfill dispensing system for integrated circuitsFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Aug 2, 2011·1 cites·18 claims
- 0644US2022077142A1Method of Packaging a Rectifying Device and a Rectifying DeviceBOSCH AUSTRALIA·Filed 2021·Application pending·0 cites
- 0739US8338828B2Semiconductor package and method of testing sameLOW BOON YEW·Filed 2010·Granted Dec 25, 2012·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →