Inventor · disambiguated record
Chin-Te Huang
Also filed as: HUANG CHIN-TE
8 granted patents·3 pending applications·132 citations·filing 1998–2020
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG7CHEN CHI-SAN1HSIAO WEI-TIEN1POWERCHIP SEMICONDUCTOR MFG CORP1SEMICONDUCTOR MFG INT SHANGHAI1
Top patents by PatentIndex Score
11 records- 0193US8075661B2Ultra-hard composite material and method for manufacturing the sameCHEN CHI-SAN·Filed 2008·Granted Dec 13, 2011·39 cites·12 claims
- 0279US6877359B2Liquid leak detectionTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 12, 2005·26 cites·22 claims
- 0374US6440570B2Stable thin film oxide standardTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 27, 2002·15 cites·8 claims
- 0472US6444541B1Method for forming lining oxide in shallow trench isolation incorporating pre-annealing stepTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 3, 2002·23 cites·17 claims
- 0566US6723613B2Method of forming an isolated-grain rugged polysilicon surface via a temperature ramping stepSEMICONDUCTOR MFG INT SHANGHAI·Filed 2002·Granted Apr 20, 2004·11 cites·20 claims
- 0665US6881675B2Method and system for reducing wafer edge tungsten residue utilizing a spin etchTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 19, 2005·11 cites·16 claims
- 0754US6695921B2Hoop support for semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 24, 2004·5 cites·13 claims
- 0839US2006205217A1Method and system for reducing wafer edge tungsten residue utilizing a spin etchTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 0938US2021217792A1Image sensor structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Application pending·0 cites
- 1036US2006166008A1Mouse padHSIAO WEI-TIEN·Filed 2005·Application pending·0 cites
- 1131US6221790B1Stable thin film oxide standardTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 24, 2001·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →