Inventor · disambiguated record
Stephen N. Golovato
Also filed as: GOLOVATO STEPHEN · GOLOVATO STEPHEN N
6 granted patents·3 pending applications·173 citations·filing 1999–2016
83Inventor score
Top patents by PatentIndex Score
9 records- 0189US6779481B2Electrical coupling between chamber parts in electronic device processing equipmentTOKYO ELECTRON LTD·Filed 2001·Granted Aug 24, 2004·50 cites·27 claims
- 0284US6173673B1Method and apparatus for insulating a high power RF electrode through which plasma discharge gases are injected into a processing chamberTOKYO ELECTRON LTD·Filed 1999·Granted Jan 16, 2001·97 cites·19 claims
- 0360US9355864B2Method for increasing adhesion of copper to polymeric surfacesTEL NEXX INC·Filed 2014·Granted May 31, 2016·1 cites·20 claims
- 0457US6695318B2Electronic device processing equipment having contact gasket between chamber partsTOKYO ELECTRON LTD·Filed 2001·Granted Feb 24, 2004·3 cites·31 claims
- 0552US6143144AMethod for etch rate enhancement by background oxygen control in a soft etch systemTOKYO ELECTRONLTD·Filed 1999·Granted Nov 7, 2000·22 cites·27 claims
- 0650US9147588B2Substrate processing pallet with coolingGOODMAN DANIEL·Filed 2007·Granted Sep 29, 2015·0 cites·27 claims
- 0745US2011024964A1Substrate processing pallet with coolingNEXX SYSTEMS INC·Filed 2010·Application pending·0 cites
- 0842US2016260673A1Method for Increasing Adhesion of Copper to Polymeric SurfacesTEL NEXX INC·Filed 2016·Application pending·0 cites
- 0941US2016071703A1Method for Increasing Adhesion of Copper to Polymeric SurfacesTEL NEXX INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →