Inventor · disambiguated record
Makoto Imahori
Also filed as: IMAHORI MAKOTO
6 granted patents·9 pending applications·0 citations·filing 2006–2025
63Inventor score
Top patents by PatentIndex Score
15 records- 0165US12258493B2Adhesive composition, film-like adhesive and multilayer filmTOAGOSEI CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·7 claims
- 0264US12448546B2Assembly for fuel cell, and laminated bodyTOYO BOSEKI·Filed 2020·Granted Oct 21, 2025·0 cites·20 claims
- 0364US2025171663A1Adhesive composition and adhesion methodTOAGOSEI CO LTD·Filed 2025·Application pending·0 cites
- 0462US2022332984A1Adhesive composition and adhesion methodTOAGOSEI CO LTD·Filed 2020·Application pending·0 cites
- 0559US12215250B2Adhesive composition and heat-fusible member using sameTOAGOSEI CO LTD·Filed 2018·Granted Feb 4, 2025·0 cites·23 claims
- 0655US12241005B2Laminated bodyTOYO BOSEKI·Filed 2020·Granted Mar 4, 2025·0 cites·20 claims
- 0755US2024301246A1Multilayer sheet and production method thereofTOAGOSEI CO LTD·Filed 2022·Application pending·0 cites
- 0855US2024383240A1Multilayer sheet and production method thereofTOAGOSEI CO LTD·Filed 2022·Application pending·0 cites
- 0953US9309373B2Adhesive composition and thermally adhesive member using sameITO TAKAHIRO·Filed 2011·Granted Apr 12, 2016·0 cites·11 claims
- 1052US2024218210A1Multilayer sheet and production method thereofTOAGOSEI CO LTD·Filed 2022·Application pending·0 cites
- 1149US2021087438A1Adhesive composition for batteries and adhesive member for batteries using sameTOAGOSEI CO LTD·Filed 2019·Application pending·0 cites
- 1246US10239287B2Molding packaging material and method for producing sameSHOWA DENKO PACKAGING CO LTD·Filed 2013·Granted Mar 26, 2019·0 cites·14 claims
- 1345US2019390093A1Polyester-based resin compositionTOAGOSEI CO LTD·Filed 2017·Application pending·0 cites
- 1441US2019256749A1Polyester-based resin compositionTOAGOSEI CO LTD·Filed 2017·Application pending·0 cites
- 1537US2009071703A1Conductive paste, circuit board, circuit article and method for manufacturing such circuit articleTOAGOSEI CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →