Inventor · disambiguated record
Yoshinori Mabuchi
Also filed as: MABUCHI YOSHINORI
11 granted patents·4 pending applications·65 citations·filing 1996–2015
86Inventor score
Top patents by PatentIndex Score
15 records- 0186US9944787B2Resin composition, prepreg and laminateMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Apr 17, 2018·4 cites·22 claims
- 0286US9775238B2Resin composition, and prepreg and laminate using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2012·Granted Sep 26, 2017·5 cites·21 claims
- 0379US9832870B2Resin composition, prepreg, metal foil-clad laminate and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Nov 28, 2017·2 cites·11 claims
- 0476US9475761B2Method for producing cyanogen-halide, cyanate ester compound and method for producing the same, and resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Oct 25, 2016·2 cites·19 claims
- 0574US6254946B1Oxygen-absorbing component, oxygen absorbent package and oxygen-absorbing multilayered body containing sameMITSUBISHI GAS CHEMICAL CO·Filed 1998·Granted Jul 3, 2001·33 cites·35 claims
- 0656US6117538ADeoxidizing multilayered body and method or manufacturing the sameMITSUBISHI GAS CHEMICAL CO·Filed 1996·Granted Sep 12, 2000·19 cites·27 claims
- 0752US9949369B2Cyanate ester compound, curable resin composition containing the same, and hardened product thereofMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Apr 17, 2018·0 cites·23 claims
- 0851US11161979B2Resin composition, prepreg, metallic foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Nov 2, 2021·0 cites·11 claims
- 0948US2016237246A1Resin composition, prepreg, laminated sheet, and metal-foil-clad laminated boardMITSUBISHI GAS CHEMICAL CO·Filed 2014·Application pending·0 cites
- 1047US2016125972A1Resin composition, prepreg, resin sheet and metal foil-clad laminateMITSUBISHI GAS CHEMICAL CO·Filed 2014·Application pending·0 cites
- 1143US2015034369A1Resin composition for printed wiring boardsKASHIMA NAOKI·Filed 2012·Application pending·0 cites
- 1242US10034371B2Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jul 24, 2018·0 cites·13 claims
- 1340US9706651B2Resin composition, prepreg, and laminateMITSUBISHI GAS CHEMICAL CO·Filed 2012·Granted Jul 11, 2017·0 cites·8 claims
- 1439US9351397B2Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using sameMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted May 24, 2016·0 cites·18 claims
- 1534US2013101863A1Heat curable compositionMABUCHI YOSHINORI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshinori Mabuchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →