Inventor · disambiguated record
Chang-Yueh Chan
Also filed as: CHAN CHANG-YUEH
12 granted patents·14 pending applications·62 citations·filing 2007–2014
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD15CHAN CHANG-YUEH5LAI CHIEH-LUNG3CHIU CHI-HSIN2SILICONWARE PREC INDUCTRIES CO1
Top patents by PatentIndex Score
26 records- 0194US8154115B1Package structure having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Apr 10, 2012·16 cites·15 claims
- 0292US8420430B2Fabrication method of package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Apr 16, 2013·17 cites·9 claims
- 0379US8471284B2LED package structure and fabrication method thereofLAI CHIEH-LUNG·Filed 2011·Granted Jun 25, 2013·9 cites·10 claims
- 0479US7858446B2Sensor-type semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 28, 2010·9 cites·20 claims
- 0573US8618641B2Leadframe-based semiconductor packageCHAN CHANG-YUEH·Filed 2008·Granted Dec 31, 2013·6 cites·28 claims
- 0672US8716070B2Fabrication method of package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·2 cites·26 claims
- 0767US8198689B2Package structure having micro-electromechanical element and fabrication method thereofCHAN CHANG-YUEH·Filed 2010·Granted Jun 12, 2012·2 cites·9 claims
- 0863US8866236B2Package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Oct 21, 2014·1 cites·14 claims
- 0958US9254994B2Package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·13 claims
- 1050US8564115B2Package structure having micro-electromechanical elementCHAN CHANG-YUEH·Filed 2012·Granted Oct 22, 2013·0 cites·8 claims
- 1149US9130064B2Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·15 claims
- 1247US2008197438A1Sensor semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1346US2008303111A1Sensor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1446US2008296716A1Sensor semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1546US2009057799A1Sensor semiconductor device and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1646US2008237767A1Sensor-type semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1746US2009166831A1Sensor semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1846US2009039527A1Sensor-type package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1945US2008283982A1Multi-chip semiconductor device having leads and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2045US2008105941A1Sensor-type semiconductor package and fabricationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 2145US2008079105A1Sensor-type package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 2245US2008203511A1Sensor-type semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2344US2008185671A1Sensor semiconductor package and fabricationSILICONWARE PREC INDUCTRIES CO·Filed 2008·Application pending·0 cites
- 2440US8653661B2Package having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Feb 18, 2014·0 cites·18 claims
- 2531US2012286308A1Led package structure and method of fabricating the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
- 2630US2012127693A1Light-permeating cover board, method of fabricating the same, and package having the sameLAI CHIEH-LUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →