Inventor · disambiguated record
Cindy Goldberg
Also filed as: GOLDBERG CINDY · GOLDBERG CINDY K · GOLDBERG CINDY KAY
11 granted patents·4 pending applications·229 citations·filing 1999–2013
90Inventor score
Top patents by PatentIndex Score
15 records- 0193US8476765B2Copper interconnect structure having a graphene capZHANG JOHN HONGGUANG·Filed 2010·Granted Jul 2, 2013·24 cites·25 claims
- 0289US6297155B1Method for forming a copper layer over a semiconductor waferMOTOROLA INC·Filed 1999·Granted Oct 2, 2001·132 cites·42 claims
- 0386US8987780B2Graphene capped HEMT deviceST MICROELECTRONICS INC·Filed 2013·Granted Mar 24, 2015·8 cites·10 claims
- 0485US7691756B2Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor deviceNXP BV·Filed 2006·Granted Apr 6, 2010·10 cites·19 claims
- 0582US8900990B2System and method of combining damascenes and subtract metal etch for advanced back end of line interconnectionsST MICROELECTRONICS INC·Filed 2012·Granted Dec 2, 2014·6 cites·11 claims
- 0680US6838354B2Method for forming a passivation layer for air gap formationFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 4, 2005·24 cites·17 claims
- 0772US7994069B2Semiconductor wafer with low-K dielectric layer and process for fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 9, 2011·4 cites·8 claims
- 0870US9002493B2Endpoint detector for a semiconductor processing station and associated methodsZHANG JOHN H·Filed 2012·Granted Apr 7, 2015·2 cites·31 claims
- 0966US6690580B1Integrated circuit structure with dielectric islands in metallized regionsAMD INC·Filed 2002·Granted Feb 10, 2004·14 cites·15 claims
- 1052US6774053B1Method and structure for low-k dielectric constant applicationsFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 10, 2004·5 cites·11 claims
- 1146US7951729B2Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor deviceNXP BV·Filed 2010·Granted May 31, 2011·0 cites·19 claims
- 1240US2009134496A1Wafer and method of forming alignment markersFREESCALE SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 1339US2009301867A1Integrated system for semiconductor substrate processing using liquid phase metal depositionCITIBANK NA·Filed 2006·Application pending·0 cites
- 1436US2012122373A1Precise real time and position low pressure control of chemical mechanical polish (cmp) headZHANG JOHN H·Filed 2010·Application pending·0 cites
- 1534US2004002210A1Interconnect structure and method for formingFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Cindy Goldberg files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →