Inventor · disambiguated record
Yunrae Cho
Also filed as: CHO YUNRAE
7 granted patents·8 pending applications·1 citations·filing 2020–2024
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0179US11335668B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 0276US12119329B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0371US11769755B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0467US12154881B2Integrated circuit device having redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·15 claims
- 0561US2025149490A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025176107A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0755US11640951B2Integrated circuit device having redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 2, 2023·0 cites·20 claims
- 0854US12456671B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0952US2025132275A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1050US2025006619A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1149US2023086202A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1249US2025167151A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1346US2024170429A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1445US11776894B2Semiconductor chip including low-k dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·18 claims
- 1544US2023005883A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →