Inventor · disambiguated record
Chi-Yu Wang
Also filed as: WANG CHI · WANG CHI-YU
8 granted patents·8 pending applications·36 citations·filing 2003–2023
80Inventor score
Files withADVANCED SEMICONDUCTOR ENG8BEIJING TUSEN ZHITU TECH CO LTD2TSAI MON-CHIN2ADVANCED CHIP ENG TECH INC1MITAC COMPUTING TECH CORP1
Top patents by PatentIndex Score
16 records- 0193US9773753B1Semiconductor devices and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 26, 2017·30 cites·24 claims
- 0282US11037898B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·4 cites·16 claims
- 0380US11784152B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·1 cites·20 claims
- 0467US10763234B2Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layerADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 1, 2020·1 cites·15 claims
- 0561US11101237B2Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layerADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 0649US2024001765A1Control system, method and device for vehicle redundant power supplyBEIJING TUSEN ZHITU TECH CO LTD·Filed 2023·Application pending·0 cites
- 0746US11175715B2Method of supplying electric power to a computer systemMITAC COMPUTING TECH CORP·Filed 2020·Granted Nov 16, 2021·0 cites·19 claims
- 0844US2009127686A1Stacking die package structure for semiconductor devices and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 0943US11404333B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 2, 2022·0 cites·19 claims
- 1043US2023164940A1Electrical boxBEIJING TUSEN ZHITU TECH CO LTD·Filed 2022·Application pending·0 cites
- 1140US2007207606A1Method for removing residual fluxADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1238US2022060268A1Broadcast receiverWang chi yu·Filed 2021·Application pending·0 cites
- 1335US7071544B2Wafer level assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 4, 2006·0 cites·14 claims
- 1432US2006103020A1Redistribution layer and circuit structure thereofTONG HO-MING·Filed 2005·Application pending·0 cites
- 1531US2006199306A1Chip structure and manufacturing process thereofTSAI MON-CHIN·Filed 2005·Application pending·0 cites
- 1631US2006197191A1Chip structure and wafer structureTSAI MON-CHIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →