Inventor · disambiguated record
Wonchul Lim
Also filed as: LIM WONCHUL
3 granted patents·26 citations·filing 2011–2015
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US8456018B2Semiconductor packagesPARK SANGWOOK·Filed 2011·Granted Jun 4, 2013·23 cites·12 claims
- 0272US8921163B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·3 cites·13 claims
- 0329US10553514B2Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the sameKIM KEUNG BEUM·Filed 2015·Granted Feb 4, 2020·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →