Inventor · disambiguated record
Hidemi Nawafune
Also filed as: NAWAFUNE HIDEMI
15 granted patents·11 pending applications·540 citations·filing 1975–2017
94Inventor score
Files withSHIPLEY CO LLC5DAIWA FINE CHEMICALS CO LTD4ISHIHARA CHEMICAL CO LTD3NAWAFUNE HIDEMI2TIPTON MFG CO2
Top patents by PatentIndex Score
26 records- 0196US7628903B1Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2000·Granted Dec 8, 2009·70 cites·3 claims
- 0296US6607653B1Plating bath and process for depositing alloy containing tin and copperDAIWA FINE CHEMICALS CO LTD·Filed 2000·Granted Aug 19, 2003·86 cites·15 claims
- 0394US6183545B1Aqueous solutions for obtaining metals by reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted Feb 6, 2001·142 cites·12 claims
- 0490US7938948B2Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2009·Granted May 10, 2011·6 cites·10 claims
- 0588US4804410APalladium-base electroless plating solutionISHIHARA CHEMICAL CO LTD·Filed 1987·Granted Feb 14, 1989·76 cites·14 claims
- 0677US6235093B1Aqueous solutions for obtaining noble metals by chemical reductive depositionDAIWA FINE CHEMICALS CO LTD·Filed 1999·Granted May 22, 2001·47 cites·4 claims
- 0774US4650691AElectroless copper plating bath and methodUEMURA KOGYO KK·Filed 1984·Granted Mar 17, 1987·28 cites·26 claims
- 0871US7166152B2Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the methodDAIWA FINE CHEMICALS CO LTD·Filed 2003·Granted Jan 23, 2007·13 cites·27 claims
- 0970US8261437B2Method for manufacturing a circuit boardYANAGIMOTO HIROSHI·Filed 2008·Granted Sep 11, 2012·6 cites·5 claims
- 1070US4541902AAnalytical method for determining formaldehyde in electroless copper plating bathUEMURA KOGYO KK·Filed 1984·Granted Sep 17, 1985·25 cites·10 claims
- 1166US6899781B2Method for forming resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 31, 2005·6 cites·13 claims
- 1263US8071178B2Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal filmNAKAJIMA SEIJI·Filed 2006·Granted Dec 6, 2011·3 cites·28 claims
- 1360US4253916AVibratory plating methodTIPTON MFG CO·Filed 1979·Granted Mar 3, 1981·12 cites·13 claims
- 1458US4229276AVibratory plating apparatusTIPTON MFG CO·Filed 1979·Granted Oct 21, 1980·11 cites·8 claims
- 1549US4064022AMethod of recovering metals from sludgesKAWASAKI MOTOO·Filed 1975·Granted Dec 20, 1977·9 cites·6 claims
- 1647US2006159854A1Method for forming inorganic thin film on polyimide resin and method for producing polyimide resin having reformed surface for forming inorganic thin filmMITSUBOSHI BELTING LTD·Filed 2005·Application pending·0 cites
- 1746US2005164020A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1845US2009134364A1Polyamide acid containing ultrafine metal particleNAWAFUNE HIDEMI·Filed 2006·Application pending·0 cites
- 1945US2020040477A1Plating solution and method for producing plated productTECHNO ROLL CO LTD·Filed 2017·Application pending·0 cites
- 2042US2007212496A1Process for Producing Metal Nonoparticle Composite FilmTOMITA SATOSHI·Filed 2004·Application pending·0 cites
- 2142US2006165877A1Method for forming inorganic thin film pattern on polyimide resinTOYOTA MOTOR CO LTD·Filed 2005·Application pending·0 cites
- 2240US2004101665A1Direct patterning methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2338US2003003307A1Non-charging resin composite and method for manufacturing the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 2438US2004072015A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 2537US2005282384A1Method for forming protective film and electroless plating bathNAWAFUNE HIDEMI·Filed 2004·Application pending·0 cites
- 2636US2004170846A1Resin composite material and method of forming the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →