Inventor · disambiguated record
Yasuo Fukuhara
Also filed as: FUKUHARA YASUO
6 granted patents·3 pending applications·38 citations·filing 1996–2022
75Inventor score
Top patents by PatentIndex Score
9 records- 0172US5633042AProcess for manufacturing prepregs for use as electric insulating materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1996·Granted May 27, 1997·34 cites·14 claims
- 0269US8409704B2Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring boardFUKUHARA YASUO·Filed 2007·Granted Apr 2, 2013·3 cites·10 claims
- 0362US2022208671A1Semiconductor-mounted productPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0460US10522493B2Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted articlePANASONIC IP MAN CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·32 claims
- 0560US9627345B2Semiconductor-mounted product and method of producing the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Apr 18, 2017·1 cites·11 claims
- 0648US11495564B2Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Nov 8, 2022·0 cites·8 claims
- 0746US2019355655A1Semiconductor-mounted productPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 0845US9925612B2Semiconductor component, semiconductor-mounted product including the component, and method of producing the productPANASONIC IP MAN CO LTD·Filed 2014·Granted Mar 27, 2018·0 cites·5 claims
- 0936US2020172666A1Thermosetting resin composition, thermosetting sheet, semiconductor component, and semiconductor mounted articlePANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →