Inventor · disambiguated record
Robin Lethiecq
Also filed as: LETHIECQ ROBIN
2 granted patents·1 pending application·4 citations·filing 2018–2021
49Inventor score
Files withPRIMO1D3
Top patents by PatentIndex Score
3 records- 0179US11822309B2System for inserting a wire into a semiconductor chipPRIMO1D·Filed 2021·Granted Nov 21, 2023·1 cites·19 claims
- 0275US11209799B2Method for inserting a wire into a groove of a semiconductor chipPRIMO1D·Filed 2018·Granted Dec 28, 2021·3 cites·11 claims
- 0338US2023130127A1Method for manufacturing a functional chip suitable for being assembled to wire elementsPRIMO1D·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →