Inventor · disambiguated record
Seshasayee S. Ankireddi
Also filed as: ANKIREDDI SESHASAYEE · ANKIREDDI SESHASAYEE S · ANKIREDDI SESHASAYEE SS
12 granted patents·88 citations·filing 2006–2017
89Inventor score
Technology areasH10W
Files withANKIREDDI SESHASAYEE S3MAXIM INTEGRATED PRODUCTS2SUN MICROSYSTEMS INC2ANKIREDDI SESHASAYEE1Intersil Americas LLC1
Top patents by PatentIndex Score
12 records- 0195US9355932B2Heat dissipation structure for an integrated circuit (IC) chipORACLE INT CORP·Filed 2015·Granted May 31, 2016·21 cites·20 claims
- 0293US9564569B1Hermetic solution for thermal and optical sensor-in-packageMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Feb 7, 2017·24 cites·20 claims
- 0383US8331094B2Thermal and power bus stacked package architectureANKIREDDI SESHASAYEE·Filed 2011·Granted Dec 11, 2012·12 cites·20 claims
- 0481US7397664B2Heatspreader for single-device and multi-device modulesSUN MICROSYSTEMS INC·Filed 2006·Granted Jul 8, 2008·11 cites·17 claims
- 0580US7449775B1Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansionSUN MICROSYSTEMS INC·Filed 2006·Granted Nov 11, 2008·10 cites·13 claims
- 0679US8564012B2Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatusesANKIREDDI SESHASAYEE S·Filed 2012·Granted Oct 22, 2013·6 cites·22 claims
- 0765US9184108B2Heat dissipation structure for an integrated circuit (IC) chipANKIREDDI SESHASAYEE S·Filed 2011·Granted Nov 10, 2015·2 cites·15 claims
- 0862US8558396B2Bond pad configurations for semiconductor diesKELKAR NIKHIL VISHWANATH·Filed 2011·Granted Oct 15, 2013·2 cites·19 claims
- 0954US9065025B2Optoelectronic apparatuses with post-molded reflector cupsIntersil Americas LLC·Filed 2014·Granted Jun 23, 2015·0 cites·20 claims
- 1048US8796052B2Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the sameANKIREDDI SESHASAYEE S·Filed 2012·Granted Aug 5, 2014·0 cites·14 claims
- 1138US10461066B2Structure and method for hybrid optical package with glass top coverMAXIM INTEGRATED PRODUCTS·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 1238US8368205B2Metallic thermal joint for high power density chipsORACLE AMERICA INC·Filed 2010·Granted Feb 5, 2013·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Seshasayee S. Ankireddi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →