Inventor · disambiguated record
Tomoaki Kudaishi
Also filed as: KUDAISHI TOMOAKI
23 granted patents·4 pending applications·527 citations·filing 1998–2010
97Inventor score
Top patents by PatentIndex Score
27 records- 0196US7706756B2RF power moduleRENESAS TECH CORP·Filed 2007·Granted Apr 27, 2010·51 cites·14 claims
- 0295US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0394US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0494US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0592US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0692US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0791US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 0891US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 0986US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1085US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1184US6169325B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 2, 2001·82 cites·12 claims
- 1283US7962105B2RF power moduleRENESAS ELECTRONICS CORP·Filed 2010·Granted Jun 14, 2011·8 cites·16 claims
- 1383US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 1481US7995984B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·12 cites·24 claims
- 1571US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 1668US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 1768US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 1867US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 1963US7223636B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 29, 2007·11 cites·15 claims
- 2062US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 2158US6759754B1Semiconductor device and its manufacturing methodRENESAS TECH CORP·Filed 2000·Granted Jul 6, 2004·7 cites·7 claims
- 2257US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 2352US6875631B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 5, 2005·4 cites·4 claims
- 2445US2007105283A1Manufacturing method of semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2545US2005167808A1Semiconductor device, its fabrication method and electronic deviceFiled 2005·Application pending·0 cites
- 2640US2004061220A1Semiconductor device and manufacturing method thereofFiled 2003·Application pending·0 cites
- 2739US2003017652A1Semiconductor device, its fabrication method and electronic deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →