Inventor · disambiguated record
Chin-Lang Wu
Also filed as: WU CHIN-LANG
6 granted patents·5 pending applications·4 citations·filing 2008–2024
69Inventor score
Top patents by PatentIndex Score
11 records- 0184US11434334B2Composite material and foam prepared from the sameIND TECH RES INST·Filed 2019·Granted Sep 6, 2022·2 cites·18 claims
- 0284US10815336B2Branched polymer, method for preparing the same and method for preparing a foamIND TECH RES INST·Filed 2017·Granted Oct 27, 2020·2 cites·16 claims
- 0371US2025066555A1FoamIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0463US12275822B2Foam, composite material, and foaming compositionIND TECH RES INST·Filed 2021·Granted Apr 15, 2025·0 cites·24 claims
- 0553US9688813B2Thermoplastic polyester elastomer and method for manufacturing the sameIND TECH RES INST·Filed 2014·Granted Jun 27, 2017·0 cites·6 claims
- 0653US2009111966A1Copolymer and method for manufacturing the same and packaging material utilizing the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 0748US8389666B2Copolymer and method for manufacturing the same and packaging material utilizing the sameLIN CHIH-HSIANG·Filed 2011·Granted Mar 5, 2013·0 cites·8 claims
- 0846US2009111951A1Blend and packaging material utilizing the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 0944US8475696B2Method for packaging light emitting diodeLIN CHIH-HSIANG·Filed 2008·Granted Jul 2, 2013·0 cites·12 claims
- 1042US2013242578A1High thermally conductive composites and illumination deviceIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1138US2013164510A1High thermally conductive compositesCHEN CHIEN-MING·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →