Inventor · disambiguated record
Li-Chih Chen
Also filed as: CHEN LI-CHIH
10 granted patents·1 pending application·244 citations·filing 2002–2016
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG8CHEN YEN-MING1CHUNG HSIN ELECTRIC & MACHINERY MFG CORP1WISTRON CORP1
Top patents by PatentIndex Score
11 records- 0197US6743660B2Method of making a wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 1, 2004·110 cites·20 claims
- 0290US6636313B2Method of measuring photoresist and bump misalignmentTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·37 cites·20 claims
- 0389US6756294B1Method for improving bump reliability for flip chip devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 29, 2004·53 cites·26 claims
- 0470US9205588B2Temperature measurement component embedded hot runner nozzle structureWISTRON CORP·Filed 2013·Granted Dec 8, 2015·3 cites·18 claims
- 0569US7906425B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 15, 2011·4 cites·10 claims
- 0668US6974659B2Method of forming a solder ball using a thermally stable resinous protective layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 13, 2005·15 cites·19 claims
- 0767US7134199B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 14, 2006·10 cites·13 claims
- 0856US8497584B2Method to improve bump reliability for flip chip deviceCHEN YEN-MING·Filed 2004·Granted Jul 30, 2013·6 cites·9 claims
- 0954US7276454B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 2, 2007·5 cites·20 claims
- 1049US6802250B2Stencil design for solder paste printingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 12, 2004·1 cites·15 claims
- 1134US2017191412A1Hydrogen carbon cleaning method for vehicleCHUNG-HSIN ELECTRIC & MACHINERY MFG CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →