Inventor · disambiguated record
Shuuhei Murata
Also filed as: MURATA SHUUHEI
6 granted patents·12 pending applications·28 citations·filing 2003–2011
79Inventor score
Top patents by PatentIndex Score
18 records- 0178US8119236B2Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Granted Feb 21, 2012·8 cites·10 claims
- 0269US8617928B2Dicing/die bonding filmKAMIYA KATSUHIKO·Filed 2008·Granted Dec 31, 2013·4 cites·12 claims
- 0367US7517615B2Gel electrolyte, process for producing the same, and use thereofNITTO DENKO CORP·Filed 2006·Granted Apr 14, 2009·4 cites·2 claims
- 0462US7318984B2Adhesive composition-supporting separator for battery and electrode/separator laminate obtained by using the sameNITTO DENKO CORP·Filed 2003·Granted Jan 15, 2008·4 cites·7 claims
- 0557US7097940B2Gel electrolyte, process for producing the same, and use thereofNITTO DENKO CORP·Filed 2003·Granted Aug 29, 2006·8 cites·3 claims
- 0656US8357260B2Partially crosslinked adhesive-supported porous film for battery separator and its useNITTO DENKO CORP·Filed 2011·Granted Jan 22, 2013·0 cites·1 claims
- 0747US2010029059A1Dicing die-bonding filmMATSUMURA TAKESHI·Filed 2009·Application pending·0 cites
- 0847US2010129989A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0947US2010129987A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1047US2010129986A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1146US2010239866A1Dicing die-bonding filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1246US2004101757A1Partially crosslinked adhesive-supported porous film for battery separator and its useNITTO DENKO CORP·Filed 2003·Application pending·0 cites
- 1346US2009209089A1Dicing die-bonding filmMURATA SHUUHEI·Filed 2009·Application pending·0 cites
- 1446US2011053346A1Dicing/die bonding filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1544US2010028687A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 1644US2010029061A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 1744US2010233409A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2008·Application pending·0 cites
- 1833US2011052853A1Adhesive film with dicing sheet and method of manufacturing the sameSUGO YUKI·Filed 2010·Application pending·0 cites
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