Inventor · disambiguated record
Danny Retuta
Also filed as: RETUTA DANNY · RETUTA DANNY VALLEJO
6 granted patents·1 pending application·21 citations·filing 2006–2016
76Inventor score
Technology areasH10W
Files withUNITED TEST & ASSEMBLY CT LTD3UNITED TEST & ASSEMBLY CT LT2RETUTA DANNY1UNITED TEST AND ASSEMBLY CENTER LTD1
Top patents by PatentIndex Score
7 records- 0186US7375416B2Leadframe enhancement and method of producing a multi-row semiconductor packageUNITED TEST & ASSEMBLY CT LTD·Filed 2006·Granted May 20, 2008·15 cites·9 claims
- 0262US7476569B2Leadframe enhancement and method of producing a multi-row semiconductor packageUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Granted Jan 13, 2009·2 cites·7 claims
- 0359US8030768B2Semiconductor package with under bump metallization aligned with open viasUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 0455US8039951B2Thermally enhanced semiconductor package and method of producing the sameUNITED TEST & ASSEMBLY CT LT·Filed 2006·Granted Oct 18, 2011·2 cites·9 claims
- 0545US9842792B2Method of producing a semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2016·Granted Dec 12, 2017·0 cites·17 claims
- 0643US2009236726A1Package-on-package semiconductor structureUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
- 0740US9281218B2Method of producing a semiconductor packageRETUTA DANNY·Filed 2007·Granted Mar 8, 2016·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →