Inventor · disambiguated record
Yosef Kornbluth
Also filed as: KORNBLUTH YOSEF
3 granted patents·10 pending applications·0 citations·filing 2022–2023
39Inventor score
Files withINTEL CORP13
Top patents by PatentIndex Score
13 records- 0159US2024123561A1Magnet-driven chemical-mechanical polishingINTEL CORP·Filed 2022·Application pending·0 cites
- 0258US12374482B2Carrier chuck comprising a plurality of magnets and methods of forming and using thereofINTEL CORP·Filed 2022·Granted Jul 29, 2025·0 cites·4 claims
- 0358US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0455US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0652US12327749B2Carrier chuck and methods of forming and using thereofINTEL CORP·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 0752US2025219041A1Technologies for memory and power components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0852US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0951US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1050US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1149US12214579B2Dry film lamination with dynamic feedback controlINTEL CORP·Filed 2022·Granted Feb 4, 2025·0 cites·19 claims
- 1242US2024203664A1In core large area capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1341US2024153857A1High aspect ratio tgv substrates through direct hybrid bonding of thin tgv substratesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →